Packaging.
概要
| 作品: | 55 作品在 4 項出版品 4 種語言 | |
|---|---|---|
書目資訊
Message in a bottle: What anthropomorphized package designs tell consumers about themselves.
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(書目-電子資源)
Complexity management with the K-Method = price structures, IT and controlling for procurement of packaging materials /
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Role of carbon dioxide/oxygen permselectivity of ionomer films in modified atmosphere packaging of fresh-cut fruits.
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Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes.
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Oil- and Water-Resistant Paper Coatings Using Low-Cost Biodegradable Polymer Blends for Packaging Applications.
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Improving Gas Barrier Properties of Sugarcane-Based LLDPE with Cellulose Nanocrystals.
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Packaging logistics = understanding and managing the economic and environmental impacts of packaging in supply chains /
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Comparative Analysis and Demonstration of Monolithic Integration in High-Voltage Gallium Nitride Processes.
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Multidisciplinary Design Optimization of Electric Aircraft Considering Systems Modeling and Packaging.
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Interactions Between Water and Cellulose Esters : = The Effect of the Acyl Side-chain Length.
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Graphic Instructions on Packages: A New Way to Improve the Consumer Repackaging Experience with Multi-Component Products.
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Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
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The supply and demand of wine-on-tap in the United States: An examination of perceptions and experiences.
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Activity-based cost modeling and dynamic simulation study of an international reusable packaging systems.
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Design, Model and Analysis of TSV-based On-Chip PDN Interconnects for 3-D Integrated Circuits.
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Preference of consumers toward non-distorted graphics on full-body shrink sleeve labels.
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Fabrication and modification of compression molding poly(hydroxybutyrate-co-valerate) thin sheet.
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Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server.
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A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill.
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Design, Prototyping, and System-Level Analysis of a Novel Light Emitting Diode (LED) Packaging Technology.
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The Effect of Hot Fill and Hold Processing on the Performance of Multilayer Packaging Films.
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Studies of Motor-Driven Viral DNA Packaging by Single DNA Manipulation with Optical Tweezers.
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(書目-電子資源)
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