東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

FindBook

Google Book

Amazon

博客來

Rapid assessment of BGA fatigue life under vibration loading.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Rapid assessment of BGA fatigue life under vibration loading./
作者:	Wu, Mei-Ling.
面頁冊數:	1 online resource (275 pages)
附註:	Source: Dissertations Abstracts International, Volume: 68-04, Section: B.
Contained By:	Dissertations Abstracts International68-04B.
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3222637click for full text (PQDT)
ISBN:	9780542729942

Rapid assessment of BGA fatigue life under vibration loading.
Wu, Mei-Ling.

Rapid assessment of BGA fatigue life under vibration loading. - 1 online resource (275 pages)

Source: Dissertations Abstracts International, Volume: 68-04, Section: B.

Thesis (Ph.D.)--University of Maryland, College Park, 2006.

Includes bibliographical references

Ball Grid Array (BGA) packages are a relatively new package type and have rapidly become the package style of choice. Much high density, high I/O count semiconductor devices are now only offered in this package style. Designers are naturally concerned about the robustness of BGA packages in a vibration environment when their experience base is with products using more traditional compliant gull or J leaded surface mount packages. Because designers simply do not have the experience, tools are needed to assess the vibration fatigue life of BGA packages during early design stages and not have to wait for product qualification testing, or field returns, to determine if a problem exists. This dissertation emphasizes a rapid assessment methodology to determine fatigue life of BGA components. If time and money were not an issue, clearly one would use a general-purpose finite element program to determine the dynamic response of the printed wiring board in the vibration environment. Once the response of the board was determined, one would determine the location and value of the critical stress in the component of interest. Knowing the critical stress, one would estimate the fatigue life from a damage model. The time required building the FEA model, conducting the analysis, and post-process the results would take at least a few days to weeks. This is too time-consuming, except in the most critical applications. It is not a process that can be used in everyday design and what-if simulations. The rapid assessment approach proposed in this research focuses on a physics of failure type approach to damage analysis and involves global and local modeling to determine the critical stress in the component of interest. A fatigue damage model then estimates the life. Once implemented in software, i.e. the new version of CALCE_PWA, the entire fatigue life assessment is anticipated to be executed by an average engineer in real time and take only minutes to generate accurate results.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2023

Mode of access: World Wide Web

ISBN: 9780542729942Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Ball grid arraysIndex Terms--Genre/Form:

542853
Electronic books.

Rapid assessment of BGA fatigue life under vibration loading.
LDR:03353nmm a2200385K 4500 001 2357626
005 20230725053533.5
006 m o d
007 cr mn ---uuuuu
008 241011s2006 xx obm 000 0 eng d
020 $a 9780542729942
035 $a (MiAaPQ)AAI3222637
035 $a (MiAaPQ)umd:3802
035 $a AAI3222637
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Wu, Mei-Ling. $3 3698159
245 1 0 $a Rapid assessment of BGA fatigue life under vibration loading.
264 0 $c 2006
300 $a 1 online resource (275 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Dissertations Abstracts International, Volume: 68-04, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Barker, Donald.
502 $a Thesis (Ph.D.)--University of Maryland, College Park, 2006.
504 $a Includes bibliographical references
520 $a Ball Grid Array (BGA) packages are a relatively new package type and have rapidly become the package style of choice. Much high density, high I/O count semiconductor devices are now only offered in this package style. Designers are naturally concerned about the robustness of BGA packages in a vibration environment when their experience base is with products using more traditional compliant gull or J leaded surface mount packages. Because designers simply do not have the experience, tools are needed to assess the vibration fatigue life of BGA packages during early design stages and not have to wait for product qualification testing, or field returns, to determine if a problem exists. This dissertation emphasizes a rapid assessment methodology to determine fatigue life of BGA components. If time and money were not an issue, clearly one would use a general-purpose finite element program to determine the dynamic response of the printed wiring board in the vibration environment. Once the response of the board was determined, one would determine the location and value of the critical stress in the component of interest. Knowing the critical stress, one would estimate the fatigue life from a damage model. The time required building the FEA model, conducting the analysis, and post-process the results would take at least a few days to weeks. This is too time-consuming, except in the most critical applications. It is not a process that can be used in everyday design and what-if simulations. The rapid assessment approach proposed in this research focuses on a physics of failure type approach to damage analysis and involves global and local modeling to determine the critical stress in the component of interest. A fatigue damage model then estimates the life. Once implemented in software, i.e. the new version of CALCE_PWA, the entire fatigue life assessment is anticipated to be executed by an average engineer in real time and take only minutes to generate accurate results.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2023
538 $a Mode of access: World Wide Web
650 4 $a Mechanical engineering. $3 649730
650 4 $a Packaging. $3 585030
653 $a Ball grid arrays
653 $a Fatigue life
653 $a Vibration
655 7 $a Electronic books. $2 lcsh $3 542853
690 $a 0548
690 $a 0549
710 2 $a ProQuest Information and Learning Co. $3 783688
710 2 $a University of Maryland, College Park. $3 657686
773 0 $t Dissertations Abstracts International $g 68-04B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3222637 $z click for full text (PQDT)