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A Thermomechanical Fatigue Life Pred...

Serebreni, Maxim.

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A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill./
作者:	Serebreni, Maxim.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2019,
面頁冊數:	198 p.
附註:	Source: Dissertations Abstracts International, Volume: 81-05, Section: B.
Contained By:	Dissertations Abstracts International81-05B.
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=13898313
ISBN:	9781687912473

A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill.
Serebreni, Maxim.

A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill. - Ann Arbor : ProQuest Dissertations & Theses, 2019 - 198 p.

Source: Dissertations Abstracts International, Volume: 81-05, Section: B.

Thesis (Ph.D.)--University of Maryland, College Park, 2019.

This item must not be sold to any third party vendors.

Underfill materials were originally developed to improve the thermo-mechanical reliability of flip-chip devices due to the large coefficient of thermal expansion (CTE) mismatch between the silicon die and substrate. More recently, underfill materials, specifically reworkable underfills, have been used to improve reliability of second level interconnects in ball grid array (BGA) packages in harsh end-use environments such as automotive, military and aerospace. In these environments, electronic components are exposed to mechanical shock, vibration, and large fluctuations in temperatures. Although reworkable underfills improve the reliability of BGA components under mechanical shock and vibration, some reworkable underfills have been shown to reduce reliability during thermal cycling environments.Consequently, this research employs experimental and numerical approaches to investigate the impact of reworkable underfill materials on thermomechanical fatigue life of solder joints in BGA packages. In the first section of the analysis, material characterization of a reworkable underfill is performed to determine appropriate material models for reworkable underfills. In the second analysis section, a variety of underfill materials with different properties are exposed to harsh and benign thermal cycles to determine the stress state responsible for reducing fatigue life of solder joints in BGA packages. In the final analysis section, simulations are performed on the BGAs with reworkable underfill to develop a fatigue life predication methodology that implements a modified mode separation scheme. The model developed in this work provides a working fatigue life approach for BGA packages with reworkable underfills exposed to thermal loading. The results of this study can be utilized by the automotive, military, and aerospace industries to optimize underfill material selection process and provide reliability assessment of BGA components in real world environments.

ISBN: 9781687912473Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Ball grid array

A Thermomechanical Fatigue Life Prediction Methodology for Ball Grid Array Components with Reworkable Underfill.
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506 $a This item must not be sold to any third party vendors.
506 $a This item must not be added to any third party search indexes.
520 $a Underfill materials were originally developed to improve the thermo-mechanical reliability of flip-chip devices due to the large coefficient of thermal expansion (CTE) mismatch between the silicon die and substrate. More recently, underfill materials, specifically reworkable underfills, have been used to improve reliability of second level interconnects in ball grid array (BGA) packages in harsh end-use environments such as automotive, military and aerospace. In these environments, electronic components are exposed to mechanical shock, vibration, and large fluctuations in temperatures. Although reworkable underfills improve the reliability of BGA components under mechanical shock and vibration, some reworkable underfills have been shown to reduce reliability during thermal cycling environments.Consequently, this research employs experimental and numerical approaches to investigate the impact of reworkable underfill materials on thermomechanical fatigue life of solder joints in BGA packages. In the first section of the analysis, material characterization of a reworkable underfill is performed to determine appropriate material models for reworkable underfills. In the second analysis section, a variety of underfill materials with different properties are exposed to harsh and benign thermal cycles to determine the stress state responsible for reducing fatigue life of solder joints in BGA packages. In the final analysis section, simulations are performed on the BGAs with reworkable underfill to develop a fatigue life predication methodology that implements a modified mode separation scheme. The model developed in this work provides a working fatigue life approach for BGA packages with reworkable underfills exposed to thermal loading. The results of this study can be utilized by the automotive, military, and aerospace industries to optimize underfill material selection process and provide reliability assessment of BGA components in real world environments.
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