語系:
繁體中文
English
說明(常見問題)
回圖書館首頁
手機版館藏查詢
登入
跳至 :
概要
書目資訊
主題
Microelectronic packaging.
概要
作品:
11 作品在 5 項出版品 5 種語言
書目資訊
Polymers in microelectronics : = fundamentals and applications /
by:
(書目-語言資料,印刷品)
Microvias = for low cost, high density interconnects /
by:
(書目-語言資料,印刷品)
Force Sensors for Microelectronic Packaging Applications
by:
(書目-語言資料,印刷品)
Hot Cracking Phenomena in Welds
by:
(書目-語言資料,印刷品)
Materials for advanced packaging
by:
(書目-語言資料,印刷品)
RF and Microwave Microelectronics Packaging
by:
(書目-語言資料,印刷品)
Bio and nano packaging techniques for electron devices = advances in electronic device packaging /
by:
(書目-電子資源)
RF and microwave microelectronics packaging II
by:
(書目-電子資源)
Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /
by:
(書目-電子資源)
Chiplet design and heterogeneous integration packaging
by:
(書目-電子資源)
Advanced MEMS packaging
by:
(書目-電子資源)
更多
較少的
主題
Chemistry.
Electronics and Microelectronics, Instrumentation
Microwaves, RF and Optical Engineering
Microwaves, RF and Optical Engineering.
Wire bonding (Electronic packaging)
Nanotechnology.
Packaging- Materials.
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Material Science.
Circuits and Systems
Materials Engineering.
Polymers.
Microsystems and MEMS.
Printed circuits.
Continuum Mechanics and Mechanics of Materials.
Materials Science.
Circuits and Systems.
Integrated circuits- Design and construction.
Microelectronics- Materials.
Semiconductors- Junctions.
Metallic Materials.
Microelectronic packaging.
Optical and Electronic Materials.
Physics and Applied Physics in Engineering.
Engineering
Characterization and Evaluation of Materials.
Engineering.
Electronic Circuits and Systems.
Integrated circuits- Design and construction
Quality Control, Reliability, Safety and Risk.
處理中
...
變更密碼
登入