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RF and microwave microelectronics pa...

Sturdivant, Rick.

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RF and microwave microelectronics packaging II

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	RF and microwave microelectronics packaging II/ edited by Ken Kuang, Rick Sturdivant.
其他作者:	Sturdivant, Rick.
出版者:	Cham :Springer International Publishing : : 2017.,
面頁冊數:	xii, 172 p. :ill. (some col.), digital ;24 cm.
內容註:	Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.
Contained By:	Springer eBooks
標題:	Microelectronic packaging. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-51697-4
ISBN:	9783319516974

RF and microwave microelectronics packaging II
RF and microwave microelectronics packaging II[electronic resource] /edited by Ken Kuang, Rick Sturdivant. - Cham :Springer International Publishing :2017. - xii, 172 p. :ill. (some col.), digital ;24 cm.

Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

ISBN: 9783319516974

Standard No.: 10.1007/978-3-319-51697-4doiSubjects--Topical Terms:

699664
Microelectronic packaging.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381046

RF and microwave microelectronics packaging II
LDR:03059nmm a2200325 a 4500 001 2092821
003 DE-He213
005 20170913153029.0
006 m d
007 cr nn 008maaau
008 171117s2017 gw s 0 eng d
020 $a 9783319516974 $q (electronic bk.)
020 $a 9783319516967 $q (paper)
024 7 $a 10.1007/978-3-319-51697-4 $2 doi
035 $a 978-3-319-51697-4
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7870.15
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TEC008070 $2 bisacsh
082 0 4 $a 621.381046 $2 23
090 $a TK7870.15 $b .R467 2017
245 0 0 $a RF and microwave microelectronics packaging II $h [electronic resource] / $c edited by Ken Kuang, Rick Sturdivant.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2017.
300 $a xii, 172 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.
520 $a Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
650 0 $a Microelectronic packaging. $3 699664
650 1 4 $a Engineering. $3 586835
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Microwaves, RF and Optical Engineering. $3 893985
650 2 4 $a Circuits and Systems. $3 896527
700 1 $a Sturdivant, Rick. $3 3227087
700 1 $a Kuang, Ken. $3 1066605
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-51697-4
950 $a Engineering (Springer-11647)