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Materials for advanced packaging

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Lu, Daniel.

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Materials for advanced packaging

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Materials for advanced packaging/ edited by Daniel Lu, C.P. Wong.
other author:	Lu, Daniel.
Published:	Boston, MA :Springer US, : 2009.,
Description:	xii, 316 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Microelectronic packaging. -
Online resource:	http://dx.doi.org/10.1007/978-0-387-78219-5
ISBN:	9780387782188 (paper)

Materials for advanced packaging
Materials for advanced packaging[electronic resource] /edited by Daniel Lu, C.P. Wong. - Boston, MA :Springer US,2009. - xii, 316 p. :ill., digital ;24 cm.

ISBN: 9780387782188 (paper)Subjects--Topical Terms:

699664
Microelectronic packaging.

LC Class. No.: TK7874 / .M38 2009

Dewey Class. No.: 621.381046

Materials for advanced packaging
LDR:00721nam 2200217 a 45 001 842011
003 Springer
005 20100602
006 m d
007 cr nn 008maaau
008 100602s2009 mau j eng d
020 $a 9780387782188 (paper)
020 $a 9780387782195 (electronic bk.)
035 $a 978-0-387-78218-8
050 4 $a TK7874 $b .M38 2009
082 0 4 $a 621.381046 $2 22
245 0 0 $a Materials for advanced packaging $h [electronic resource] / $c edited by Daniel Lu, C.P. Wong.
260 $a Boston, MA : $c 2009. $b Springer US,
300 $a xii, 316 p. : $b ill., digital ; $c 24 cm.
650 0 $a Microelectronic packaging. $3 699664
650 0 $a Packaging $x Materials. $3 1001655
650 1 4 $a Material Science. $3 927800
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Metallic Materials. $3 893995
650 2 4 $a Nanotechnology. $3 526235
650 2 4 $a Optical and Electronic Materials. $3 891120
700 1 $a Lu, Daniel. $3 1001653
700 1 $a Wong, C.P. $3 1001654
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-0-387-78219-5
950 $a Chemistry and Materials Science (Springer-11644; ZDB-2-CMS)

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W9061837

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11.線上閱覽_V

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EB W9061837

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