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Die-attach materials for high temper...

Siow, Kim S.

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Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Die-attach materials for high temperature applications in microelectronics packaging/ edited by Kim S. Siow.
Reminder of title:	materials, processes, equipment, and reliability /
other author:	Siow, Kim S.
Published:	Cham :Springer International Publishing : : 2019.,
Description:	xx, 279 p. :ill., digital ;24 cm.
[NT 15003449]:	Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.
Contained By:	Springer eBooks
Subject:	Microelectronic packaging. -
Online resource:	https://doi.org/10.1007/978-3-319-99256-3
ISBN:	9783319992563

Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /
Die-attach materials for high temperature applications in microelectronics packagingmaterials, processes, equipment, and reliability /[electronic resource] :edited by Kim S. Siow. - Cham :Springer International Publishing :2019. - xx, 279 p. :ill., digital ;24 cm.

Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

ISBN: 9783319992563

Standard No.: 10.1007/978-3-319-99256-3doiSubjects--Topical Terms:

699664
Microelectronic packaging.

LC Class. No.: TK7870.15 / .D543 2019

Dewey Class. No.: 621.381046

Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /
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245 0 0 $a Die-attach materials for high temperature applications in microelectronics packaging $h [electronic resource] : $b materials, processes, equipment, and reliability / $c edited by Kim S. Siow.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2019.
300 $a xx, 279 p. : $b ill., digital ; $c 24 cm.
505 0 $a Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.
520 $a This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
650 0 $a Microelectronic packaging. $3 699664
650 1 4 $a Optical and Electronic Materials. $3 891120
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Metallic Materials. $3 893995
650 2 4 $a Characterization and Evaluation of Materials. $3 890988
650 2 4 $a Materials Engineering. $3 2071625
650 2 4 $a Quality Control, Reliability, Safety and Risk. $3 891027
700 1 $a Siow, Kim S. $3 3384340
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-3-319-99256-3
950 $a Chemistry and Materials Science (Springer-11644)