Thermomechanical analysis of multila...
Wen, Yujun.

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  • Thermomechanical analysis of multilayered microelectronics packaging: Modeling and testing.
  • Record Type: Electronic resources : Monograph/item
    Title/Author: Thermomechanical analysis of multilayered microelectronics packaging: Modeling and testing./
    Author: Wen, Yujun.
    Description: 378 p.
    Notes: Source: Dissertation Abstracts International, Volume: 64-11, Section: B, page: 5597.
    Contained By: Dissertation Abstracts International64-11B.
    Subject: Applied Mechanics. -
    Online resource: http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3113540
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  • 2 records • Pages 1 •
 
W9182501 電子資源 11.線上閱覽_V 電子書 EB 一般使用(Normal) On shelf 0
W9185526 電子資源 11.線上閱覽_V 電子書 EB 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
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