Wen, Yujun.
概要
| 作品: | 1 作品在 0 項出版品 0 種語言 | |
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書目資訊
Thermomechanical analysis of multilayered microelectronics packaging: Modeling and testing.
by:
Wen, Yujun.; State University of New York at Buffalo.
(書目-電子資源)