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Overview
Titles
Subjects
Microelectronics - Packaging.
Overview
Works:
2 works in 2 publications in 2 languages
Titles
3D microelectronic packaging = from fundamentals to applications /
by:
(Electronic resources)
3D microelectronic packaging = from architectures to applications /
by:
(Electronic resources)
Subjects
Microengineering.
Electronic circuits.
Nanotechnology.
Electronics and Microelectronics, Instrumentation.
Electronics.
Electronics- Materials.
Microelectronics- Packaging.
Nanotechnology and Microengineering.
Metallic Materials.
Optical materials.
Engineering.
Optical and Electronic Materials.
Biotechnology.
Electronic Circuits and Devices.
Metals.
Processing
...
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