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3D microelectronic packaging = from ...

Li, Yan.

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3D microelectronic packaging = from fundamentals to applications /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	3D microelectronic packaging/ edited by Yan Li, Deepak Goyal.
其他題名:	from fundamentals to applications /
其他作者:	Li, Yan.
出版者:	Cham :Springer International Publishing : : 2017.,
面頁冊數:	ix, 463 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Microelectronics - Packaging. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-44586-1
ISBN:	9783319445861

3D microelectronic packaging = from fundamentals to applications /
3D microelectronic packagingfrom fundamentals to applications /[electronic resource] :edited by Yan Li, Deepak Goyal. - Cham :Springer International Publishing :2017. - ix, 463 p. :ill., digital ;24 cm. - Springer series in advanced microelectronics,v.571437-0387 ;. - Springer series in advanced microelectronics ;v.57..

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.

ISBN: 9783319445861

Standard No.: 10.1007/978-3-319-44586-1doiSubjects--Topical Terms:

3220536
Microelectronics
--Packaging.

LC Class. No.: TK7874

Dewey Class. No.: 621.381

3D microelectronic packaging = from fundamentals to applications /
LDR:02475nmm a2200325 a 4500 001 2089683
003 DE-He213
005 20170809113114.0
006 m d
007 cr nn 008maaau
008 171013s2017 gw s 0 eng d
020 $a 9783319445861 $q (electronic bk.)
020 $a 9783319445847 $q (paper)
024 7 $a 10.1007/978-3-319-44586-1 $2 doi
035 $a 978-3-319-44586-1
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TEC008070 $2 bisacsh
082 0 4 $a 621.381 $2 23
090 $a TK7874 $b .T531 2017
245 0 0 $a 3D microelectronic packaging $h [electronic resource] : $b from fundamentals to applications / $c edited by Yan Li, Deepak Goyal.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2017.
300 $a ix, 463 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer series in advanced microelectronics, $x 1437-0387 ; $v v.57
520 $a This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.
650 0 $a Microelectronics $x Packaging. $3 3220536
650 1 4 $a Engineering. $3 586835
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Optical and Electronic Materials. $3 891120
650 2 4 $a Electronic Circuits and Devices. $3 1245773
650 2 4 $a Microengineering. $3 1085059
650 2 4 $a Nanotechnology and Microengineering. $3 1005737
650 2 4 $a Metallic Materials. $3 893995
700 1 $a Li, Yan. $3 1028952
700 1 $a Goyal, Deepak. $3 1275821
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a Springer series in advanced microelectronics ; $v v.57. $3 3220535
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-44586-1
950 $a Engineering (Springer-11647)