3D microelectronic packaging = from ...
Li, Yan.

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  • 3D microelectronic packaging = from architectures to applications /
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: 3D microelectronic packaging/ edited by Yan Li, Deepak Goyal.
    其他題名: from architectures to applications /
    其他題名: Three Dimensional microelectronic packaging
    其他作者: Li, Yan.
    出版者: Singapore :Springer Singapore : : 2021.,
    面頁冊數: xvii, 622 p. :ill., digital ;24 cm.
    內容註: 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging.
    Contained By: Springer Nature eBook
    標題: Microelectronics - Packaging. -
    電子資源: https://doi.org/10.1007/978-981-15-7090-2
    ISBN: 9789811570902
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