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MEMS packaging

Lee, Y.C.

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MEMS packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	MEMS packaging/ editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss.
other author:	Lee, Y.C.
Published:	Singapore :World Scientific, : c2018.,
Description:	1 online resource (363 p.) :ill. (some col.), ports. (some col.)
Subject:	Microelectromechanical systems. -
Online resource:	https://www.worldscientific.com/worldscibooks/10.1142/10692#t=toc
ISBN:	9789813229365

MEMS packaging
MEMS packaging[electronic resource] /editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss. - 1st ed. - Singapore :World Scientific,c2018. - 1 online resource (363 p.) :ill. (some col.), ports. (some col.) - WSPC series in advanced integration and packaging,v. 52315-473X ;. - WSPC series in advanced integration and packaging ;v. 5..

Includes bibliographical references and index.

"MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability."--

Electronic reproduction.
Singapore :
World Scientific,
[2017]

Mode of access: World Wide Web.

ISBN: 9789813229365Subjects--Topical Terms:

567138
Microelectromechanical systems.

LC Class. No.: TK7875 / .M46 2018

Dewey Class. No.: 621.381

MEMS packaging
LDR:02604cmm a2200301 a 4500 001 2182711
003 WSP
005 20170718005225.4
006 m o d
007 cr cnu---unuuu
008 191202s2018 si ac ob 001 0 eng d
020 $a 9789813229365 $q (electronic bk.)
020 $z 9789813229358 $q (hbk.)
035 $a 00010692
040 $a WSPC $b eng $c WSPC
041 0 $a eng
050 0 4 $a TK7875 $b .M46 2018
082 0 4 $a 621.381 $2 23
245 0 0 $a MEMS packaging $h [electronic resource] / $c editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss.
250 $a 1st ed.
260 $a Singapore : $b World Scientific, $c c2018.
300 $a 1 online resource (363 p.) : $b ill. (some col.), ports. (some col.)
490 1 $a WSPC series in advanced integration and packaging, $x 2315-473X ; $v v. 5
504 $a Includes bibliographical references and index.
520 $a "MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability."-- $c Provided by publisher.
533 $a Electronic reproduction. $b Singapore : $c World Scientific, $d [2017]
538 $a Mode of access: World Wide Web.
588 $a Description based on online resource; title from PDF title page (viewed December 21, 2017)
650 0 $a Microelectromechanical systems. $3 567138
650 0 $a Microelectronic pakaging. $3 3391358
650 0 $a Electronic books. $3 855788
700 1 $a Lee, Y.C. $3 3391356
700 1 $a Cheng, Yu-Ting. $3 1270360
700 1 $a Ramadoss, Ramesh. $3 1930292
830 0 $a WSPC series in advanced integration and packaging ; $v v. 5. $3 3391357
856 4 0 $u https://www.worldscientific.com/worldscibooks/10.1142/10692#t=toc