語系
Goyal, Deepak.
概要
| 作品: | 0 作品在 2 項出版品 1 種語言 | |
|---|---|---|
書目資訊
3D microelectronic packaging = from architectures to applications /
by:
Li, Yan.; Goyal, Deepak.; SpringerLink (Online service)
(書目-電子資源)
3D microelectronic packaging = from fundamentals to applications /
by:
Li, Yan.; Goyal, Deepak.; SpringerLink (Online service)
(書目-電子資源)
Analysis of linear elasticity and non-linearity due to plasticity and material damage in woven and biaxial braided composites.
by:
Goyal, Deepak.; Texas A&M University.
(書目-語言資料,印刷品)
主題
Microengineering.
Engineering, Aerospace.
Electronic circuits.
Nanotechnology.
Applied Mechanics.
Textile Technology.
Electronics and Microelectronics, Instrumentation.
Electronics.
Engineering, Mechanical.
Electronics- Materials.
Microelectronics- Packaging.
Nanotechnology and Microengineering.
Metallic Materials.
Optical materials.
Engineering.
Optical and Electronic Materials.
Biotechnology.
Electronic Circuits and Devices.
Metals.