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Epoxy resins.

概要

作品:	9 作品在 3 項出版品 3 種語言

書目資訊

Epoxy resins, curing agents, compounds, and modifiers : = an industrial guide / by: (書目-語言資料,印刷品)

Interfaces, crystallization, viscoelasticity by: (書目-語言資料,印刷品)

Handbook of epoxy/fiber composites by: (書目-電子資源)

Leveraging Polymer-water Interactions for Damage Detection in Polymer Composites. by: (書目-電子資源)

Graphite Doped PAN Nanofiber Mats Infused Polymer Composite Pipeliners : = Experimental Diffusion Characterization. by: (書目-電子資源)

Interfacial micromechanics of natural cellulose whisker polymer nanocomposites using raman spectroscopy. by: (書目-電子資源)

Investigation of Ultra-Thin Dielectrics on Coupled Capacitive and Inductive Effects in Laterally Conducting Power Device Packaging. by: (書目-電子資源)

Functional and sustainable epoxy vitrimers by: (書目-電子資源)

Multifunctional epoxy resins = self-healing, thermally and electrically conductive resins / by: (書目-電子資源)

主題

Dielectric properties.

Temperature.

Chemistry.

Materials science.

Mechanics.

Graphite.

Cathodic protection.

Sulfuric acid.

Deformation.

Semiconductors.

Design.

Nanophysics.

Corrosion resistance.

Moisture content.

Layouts.

Materials selection.

Intellectual property.

Stress-strain curves.

Cooling.

Noise.

Nanoscale Devices.

Materials Engineering.

Electromagnetism.

Nuclear magnetic resonance--NMR.

Protective coatings.

Analytical chemistry.

Fourier transforms.

Biology.

Industrial engineering.

Conductivity.

Epoxy resins.

Polymers.

Fibrous composites.

Composites.

Structural Materials.

Carbon fibers.

Quantitative analysis.

Moisture absorption.

Composite materials.

Polymer chemistry.

Corrosion.

Mathematics.

Plating.

Transistors.

Packaging.

Electrical engineering.

Thermodynamics.

Block copolymers.

Environmental Engineering/Biotechnology.

Hydrogen.

Optics.

Physical properties.

Morphology.

Nanocomposites.

Energy dissipation.

Polymer Synthesis.

Mechanical properties.

Laminates.

Aerospace engineering.

Medical imaging.

Scanning electron microscopy.

Viscosity.

Power supply.

Tensile strength.

Silicon wafers.

Optimization.

Confidence intervals.

Engineering.

Physics.

Failure.

Crude oil.

Thermogravimetric analysis.

Magnetic fields.

Electric fields.

Printed circuit boards.

Heat conductivity.

Electromagnetics.

Polymer crystals.

Thin films- Surfaces.

Biopolymers.

Metals.

Spectrum analysis.

Artificial intelligence.

Steel.

Carbon.

Cotton.

Cellulose.

Metal fatigue.

Intermetallic compounds.

Research & development--R&D.

Sintering.