Electronic packaging - Congresses.
Overview
| Works: | 11 works in 1 publications in 1 languages | |
|---|---|---|
Titles
MCM C/mixed technologies and thick film sensors : = proceedings of the NATO Advanced Study Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM), Islamaorada, Florida, USA, May 23-25, 1994 /
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(Language materials, printed)
Electronic packaging materials science III : = symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
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(Language materials, printed)
Electronic packaging materials science : = symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. /
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(Language materials, printed)
The 3rd IMPACT, the 10th EMAP joint conference proceedings : = (EMAP2008) : Oct. 22-24, 2008, Taipei /
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(Language materials, printed)
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2022, 14-15 September, Langkawi, Malaysia /
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(Electronic resources)
Electronic packaging materials science V : = symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. /
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(Language materials, printed)
Electronic packaging materials science VI : = symposium held April 27-30, 1992, San Francisco, California, U.S.A. /
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(Language materials, printed)
Electronic packaging materials science VII : = symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A. /
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(Language materials, printed)
Electronic packaging materials science IV : = symposium held April 24-28, 1989, San Diego, California, U.S.A. /
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(Language materials, printed)
Electronic packaging materials science II : = symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
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(Language materials, printed)
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