無鉛銲料
Overview
| Works: | 4 works in 0 publications in 0 languages | |
|---|---|---|
Titles
Bi-Ag高溫無鉛銲料與基材介面反應研究 = = Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates
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(Language materials, printed)
Sn-Ag-Cu無鉛銲料合金改質效應探討 = = Alloying modification effects on the properties of Sn-Ag-Cu Pb-free solders /
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(Language materials, printed)
添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /
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(Language materials, printed)
球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /
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(Language materials, printed)