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A multifunctional silicon micromachi...

Selvakumar, Arjun.

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A multifunctional silicon micromachining technology for high performance microsensors and microactuators.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	A multifunctional silicon micromachining technology for high performance microsensors and microactuators./
作者:	Selvakumar, Arjun.
面頁冊數:	292 p.
附註:	Chair: Khalil Najafi.
Contained By:	Dissertation Abstracts International58-05B.
標題:	Engineering, Automotive. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9732179
ISBN:	9780591416893

A multifunctional silicon micromachining technology for high performance microsensors and microactuators.
Selvakumar, Arjun.

A multifunctional silicon micromachining technology for high performance microsensors and microactuators. - 292 p.

Chair: Khalil Najafi.

Thesis (Ph.D.)--University of Michigan, 1997.

Two goals were achieved in this thesis--(a) development of a new Trench Refilling for MEMS (TRiM) technology and (b) demonstration through three novel MEMS devices--(i) milli-g sensitivity, multi-axis accelerometers; (ii) large throw, linear vertical actuators and (iii) polysilicon neural probes.

ISBN: 9780591416893Subjects--Topical Terms:

1018477
Engineering, Automotive.

A multifunctional silicon micromachining technology for high performance microsensors and microactuators.
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100 1 $a Selvakumar, Arjun. $3 1295795
245 1 2 $a A multifunctional silicon micromachining technology for high performance microsensors and microactuators.
300 $a 292 p.
500 $a Chair: Khalil Najafi.
500 $a Source: Dissertation Abstracts International, Volume: 58-05, Section: B, page: 2594.
502 $a Thesis (Ph.D.)--University of Michigan, 1997.
520 $a Two goals were achieved in this thesis--(a) development of a new Trench Refilling for MEMS (TRiM) technology and (b) demonstration through three novel MEMS devices--(i) milli-g sensitivity, multi-axis accelerometers; (ii) large throw, linear vertical actuators and (iii) polysilicon neural probes.
520 $a The TRiM technology based on trenches refilled with LPCVD layers helps create (i) high aspect ratio ($> $1 6) structures with sub-micron air gaps; (ii) stiffening of 2$\mu $m thick LPCVD layers by more than two orders of magnitude and (iii) lateral and vertical high aspect-ratio suspension beams. Using TRiM two processes--Trench Refilled with Oxide (TReO) and Trench Refilled with Polyilicon (TRiPs)--were demonstrated providing complete, released micromechanisms from a single standard silicon wafer with integrated electrical isolation and feedthrough capabilities.
520 $a Capacitive multi-axis, single chip, milli-g sensitivity accelerometers were designed with sensitivities of 50-200fF/g, a minimum detectable acceleration of less than 50$\mu $g /$\surd $h z and a bandwidth of 200-1kHz. Furthermore, a new torsional accelerometer design is presented having high sensitivity, excellent linearity, wide dynamic range, high bandwidth and overcoming pull-in voltage instability. The accelerometers were fabricated using the TRiPs and the dissolved wafer processes (DWP). The DWP torsional accelerometer yielded sensitivities of 35-40fF/g, a dynamic range of 10g with a non-linearity of 0.2% over a 7g range and a 3dB cut-off frequency of 30Hz.
520 $a A Vertical Comb Array Microactuator was developed with refilled polysilicon beams and boron doped silicon beams. These actuators have an inherent linear characteristic, a range independent of gap spacing, and avoid pull-in voltage instability. Fabricated devices yielded 3-4$\mu $m of deflection vertical to the wafer surface for a 0-25V DC. Pull-in voltage of 25V was observed.
520 $a A novel high strength to volume ratio surface micromachined neural probe was designed and fabricated using a 2$\mu $m thick polysilicon. Stiffening ribs 17$\mu $m thick were placed underneath the shank and the back-end of both acute probes 2.5mm in length, 800$\mu $m wide, and chronic probes with ribbon cables 22mm long and 750$\mu $m wide. EDP was used to release the probe from the re-usable substrate mold. The probes easily penetrated the pia-arachnoid layers and the cortex of a guinea pig, without any perceivable buckling.
590 $a School code: 0127.
650 4 $a Engineering, Automotive. $3 1018477
650 4 $a Engineering, Biomedical. $3 1017684
650 4 $a Engineering, Electronics and Electrical. $3 626636
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710 2 0 $a University of Michigan. $3 777416
773 0 $t Dissertation Abstracts International $g 58-05B.
790 $a 0127
790 1 0 $a Najafi, Khalil, $e advisor
791 $a Ph.D.
792 $a 1997
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9732179