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Failure of microelectromechanical sy...

University of Illinois at Urbana-Champaign.

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Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation./
作者:	Kimberley, Jamie.
面頁冊數:	171 p.
附註:	Adviser: John Lambros.
Contained By:	Dissertation Abstracts International69-05B.
標題:	Applied Mechanics. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3314822
ISBN:	9780549641568

Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation.
Kimberley, Jamie.

Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation. - 171 p.

Adviser: John Lambros.

Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.

Understanding the mechanical response of microelectromechanical systems (MEMS) under impulse loading is a prerequisite for improved design criteria and device survivability under severe loading conditions. Three classes of microscale structures comprised of (1) polysilicon, (2) pure metal and (3) metal--ceramic layers were loaded at high accelerations using a variety of dynamic experimental techniques. To achieve acceleration levels on the order of 109 g (g--acceleration due to gravity), the devices were subjected to impulsive loads 40 ns in duration generated by a high power pulsed laser. This allowed for the MEMS response to be investigated on time scales that were of the order of wave transit times in the substrate and devices. Additionally, a modified split Hopkinson pressure bar was used to test devices at accelerations ranging from 103-10 5 g with microseconds loading duration. Multiple failure modes, such as delamination of multi-layered structures and material failure (fracture), were observed, verifying that dynamic loading can lead to failure of MEMS devices despite their small mass.

ISBN: 9780549641568Subjects--Topical Terms:

1018410
Applied Mechanics.

Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation.
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245 1 0 $a Failure of microelectromechanical systems under dynamic loading: An experimental and numerical investigation.
300 $a 171 p.
500 $a Adviser: John Lambros.
500 $a Source: Dissertation Abstracts International, Volume: 69-05, Section: B, page: 3078.
502 $a Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008.
520 $a Understanding the mechanical response of microelectromechanical systems (MEMS) under impulse loading is a prerequisite for improved design criteria and device survivability under severe loading conditions. Three classes of microscale structures comprised of (1) polysilicon, (2) pure metal and (3) metal--ceramic layers were loaded at high accelerations using a variety of dynamic experimental techniques. To achieve acceleration levels on the order of 109 g (g--acceleration due to gravity), the devices were subjected to impulsive loads 40 ns in duration generated by a high power pulsed laser. This allowed for the MEMS response to be investigated on time scales that were of the order of wave transit times in the substrate and devices. Additionally, a modified split Hopkinson pressure bar was used to test devices at accelerations ranging from 103-10 5 g with microseconds loading duration. Multiple failure modes, such as delamination of multi-layered structures and material failure (fracture), were observed, verifying that dynamic loading can lead to failure of MEMS devices despite their small mass.
520 $a In order to gain detailed information on the stress state in the polysilicon structures subjected to the loads generated by the laser based testing, dynamic three-dimensional finite element simulations were preformed focusing specifically at stress concentrations generated by the device geometry. The simulations accurately predicted the location of failure recorded in the experiments although it was seen that the details of failure initiation and progression were highly dependent on geometry.
520 $a Finite element simulations were also conducted on pure Au cantilever beams subjected to impulse loading using the laser based set-up. These simulations investigated the effect of loading rate, boundary conditions, beam length, material constitutive response, and viscous damping on the deformation and final shapes of the beams. Simulation results were compared with experimental observations to gain insight on the mechanisms responsible for deformation. It was found that a contact and momentum transfer mechanism was responsible for the large deformations observed in postmortem inspection using scanning electron microscopy. Additionally, viscous damping effects were found to be dominant in determining the final deformed shape of the beams, while rate effects in material response were found to be of lesser importance---but not negligible.
520 $a The response of cantilever beams, representing modle test structures, comprised of metal and ceramic layers was also investigated. Experiments were conducted using the modified split hopkinson pressure bar to investigate the effects of loading amplitude, duration, and profile on the failure of the cantilever beams. Finite element simulations of these beams were conducted to provide more detailed information regarding the deformation of the beams under the various loadings applied in the experiments. Results of the simulations were coupled with experimental measurements of failure stress (measured in quasistatic microtensile tests) in an attempt to predict failure. High-speed imaging was also used to capture the first real-time images of MEMS structures responding to dynamic loading.
590 $a School code: 0090.
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