東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Gyroscope and micromirror design usi...

Xie, Huikai.

Linked to FindBook

Google Book

Amazon

博客來

Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing./
Author:	Xie, Huikai.
Description:	220 p.
Notes:	Adviser: Gary K. Fedder.
Contained By:	Dissertation Abstracts International63-04B.
Subject:	Engineering, Automotive. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3051015
ISBN:	0493653368

Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing.
Xie, Huikai.

Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing. - 220 p.

Adviser: Gary K. Fedder.

Thesis (Ph.D.)--Carnegie Mellon University, 2002.

This thesis introduces a deep reactive-ion-etch (DRIE) CMOS-MEMS process which incorporates bulk Si into microstructures using backside etch. The resultant microstructures are flat and have no release holes. Electrically isolated silicon is obtained using a silicon undercut. This process is suitable for applications that require large mass and flat surfaces such as inertial sensors and micromirrors.

ISBN: 0493653368Subjects--Topical Terms:

1018477
Engineering, Automotive.

Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing.
LDR:03130nam 2200337 a 45 001 936135
005 20110510
008 110510s2002 eng d
020 $a 0493653368
035 $a (UnM)AAI3051015
035 $a AAI3051015
040 $a UnM $c UnM
100 1 $a Xie, Huikai. $3 1259829
245 1 0 $a Gyroscope and micromirror design using vertical-axis CMOS-MEMS actuation and sensing.
300 $a 220 p.
500 $a Adviser: Gary K. Fedder.
500 $a Source: Dissertation Abstracts International, Volume: 63-04, Section: B, page: 2001.
502 $a Thesis (Ph.D.)--Carnegie Mellon University, 2002.
520 $a This thesis introduces a deep reactive-ion-etch (DRIE) CMOS-MEMS process which incorporates bulk Si into microstructures using backside etch. The resultant microstructures are flat and have no release holes. Electrically isolated silicon is obtained using a silicon undercut. This process is suitable for applications that require large mass and flat surfaces such as inertial sensors and micromirrors.
520 $a A technique for vertical-axis sensing and actuation using comb-finger sidewall capacitance is developed. For vertical-axis sensing, this technique has small parasitic capacitance compared to the counterparts that have an electrode on the substrate. For vertical actuation, this technique has a very large gap to substrate set by the process, so that the actuation range is not limited. A unique curled comb drive design demonstrates a maximum 62 μm out-of-plane displacement for a micro-mirror scanning.
520 $a Several thin-film and DRIE devices are fabricated and characterized. A 0.5 mm by 0.5 mm microstage moves 0.3 μm vertically at 14 V d.c. Thin-film and DRIE z-axis accelerometers (both are about 0.5 mm by 0.6 mm) have noise floors of 6 mg/Hz<super>1/2</super> and 0.5 mg/Hz<super>1/2</super>, respectively. The noise floor of a lateral-axis gyroscope is improved from 0.8°/s/Hz<super> 1/2</super> for the thin-film CMOS-MEMS process to 0.02°/s/Hz<super>1/2 </super> for the DRIE CMOS-MEMS process.
520 $a Solutions for improving the gyroscopes' performance and yield are proposed, including a new process flow for independently controlling silicon undercut and a vertical-axis electrostatic force cancellation technique for compensating the off-axis motion.
520 $a The electrostatic micromirror rotates 5° at 18 V d.c. The thermally actuated micromirror rotates 17° at 12 mA current and has been installed into an endoscopic optical coherence tomography imaging system for <italic> in vivo</italic> imaging of biological tissue. Transverse and axial resolutions of roughly 20 μm and 10 μm, respectively, are achieved. Cross-sectional images of 500 x 1000 pixels covering an area of 2.9 x 2.8 mm<super>2</super> are acquired at 5 frames/s.
590 $a School code: 0041.
650 4 $a Engineering, Automotive. $3 1018477
650 4 $a Engineering, Biomedical. $3 1017684
650 4 $a Engineering, Electronics and Electrical. $3 626636
690 $a 0540
690 $a 0541
690 $a 0544
710 2 0 $a Carnegie Mellon University. $3 1018096
773 0 $t Dissertation Abstracts International $g 63-04B.
790 $a 0041
790 1 0 $a Fedder, Gary K., $e advisor
791 $a Ph.D.
792 $a 2002
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3051015