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Multidisciplinary design and optimiz...

Stevens Institute of Technology.

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Multidisciplinary design and optimization in electronics and MEMS packaging.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Multidisciplinary design and optimization in electronics and MEMS packaging./
作者:	Suwa, Tohru.
面頁冊數:	281 p.
附註:	Adviser: Hamid Hadim.
Contained By:	Dissertation Abstracts International68-06B.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3269218
ISBN:	9780549085409

Multidisciplinary design and optimization in electronics and MEMS packaging.
Suwa, Tohru.

Multidisciplinary design and optimization in electronics and MEMS packaging. - 281 p.

Adviser: Hamid Hadim.

Thesis (Ph.D.)--Stevens Institute of Technology, 2007.

Current and future trends within the information technology and electronics industries toward higher product performance combined with continuously increasing miniaturization are creating significant challenges in electronics packaging design at every packaging level. The overall electronics packaging design process is characterized by conflicting multidisciplinary design requirements and complex trade-offs. The main objective of this research is to develop a comprehensive multidisciplinary design and optimization methodology for electronics packaging. The capabilities of the proposed design and optimization methodology are demonstrated through several case studies covering all levels of electronics packaging design. Extension of the proposed methodology to MEMS device and packaging design and optimization is also demonstrated.

ISBN: 9780549085409Subjects--Topical Terms:

783786
Engineering, Mechanical.

Multidisciplinary design and optimization in electronics and MEMS packaging.
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245 1 0 $a Multidisciplinary design and optimization in electronics and MEMS packaging.
300 $a 281 p.
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502 $a Thesis (Ph.D.)--Stevens Institute of Technology, 2007.
520 $a Current and future trends within the information technology and electronics industries toward higher product performance combined with continuously increasing miniaturization are creating significant challenges in electronics packaging design at every packaging level. The overall electronics packaging design process is characterized by conflicting multidisciplinary design requirements and complex trade-offs. The main objective of this research is to develop a comprehensive multidisciplinary design and optimization methodology for electronics packaging. The capabilities of the proposed design and optimization methodology are demonstrated through several case studies covering all levels of electronics packaging design. Extension of the proposed methodology to MEMS device and packaging design and optimization is also demonstrated.
520 $a In the proposed methodology, multidisciplinary design criteria related to thermal, mechanical, electrical, electromagnetic and component placement, among others, are optimized simultaneously using a combination of the genetic algorithm and a Pareto optimization technique based on the weighting method. An effective computational analysis method for performance prediction, which is based on a combination of the artificial neural networks (ANNs) method and a superposition technique, is developed for this study. The ANNs consist of Radial Basis Function (RBF) networks that are integrated and trained using representative finite element models such that accurate performance prediction is achieved with significant reduction in computational effort. The following case studies are used to demonstrate the proposed methodology (1) at the system (enclosure) and printed circuit board (PCB) levels optimal placement of heat generating components has been achieved based on pre-defined thermal and electrical performance constraints, (2) at the package level, Ball Grid Array (BGA) package design is optimized based on multidisciplinary criteria including thermal, thermal strain, electrical, electromagnetic leakage, and cost, (3) at the chip level, placement optimization of multiple heat generating logic blocks on a silicon chip is achieved by minimizing maximum junction temperature and wiring length, (4) finally as an extension of the methodology to MEMS, a polymerase chain reaction (PCR) microfluidics system used for DNA amplification is considered where multi-objective design optimization of the thermo-pneumatic micro-pump and associated temperature controlled reaction channel of the PCR system is demonstrated using the proposed methodology.
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