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Study of liquid transparent encapsul...

University of California, Irvine.

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Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices./
作者:	Zhou, Yan.
面頁冊數:	140 p.
附註:	Adviser: Frank G. Shi.
Contained By:	Dissertation Abstracts International69-10B.
標題:	Engineering, Materials Science. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3333278
ISBN:	9780549865766

Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices.
Zhou, Yan.

Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices. - 140 p.

Adviser: Frank G. Shi.

Thesis (Ph.D.)--University of California, Irvine, 2008.

Optically transparent polymeric materials required for the encapsulation of optoelectronic chips are critical to the manufacturability, cost, performance, and reliability of LED and other optoelectronic devices. This work is focused on the development of the transparent epoxy based liquid encapsulants with the objective to enhance the manufacturability, to reduce the cost, and to improve both the performance and the reliability of the packaged optoelectronic devices.

ISBN: 9780549865766Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices.
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100 1 $a Zhou, Yan. $3 1034102
245 1 0 $a Study of liquid transparent encapsulants for the packaging of light emitting diode and other optoelectronic devices.
300 $a 140 p.
500 $a Adviser: Frank G. Shi.
500 $a Source: Dissertation Abstracts International, Volume: 69-10, Section: B, page: 6360.
502 $a Thesis (Ph.D.)--University of California, Irvine, 2008.
520 $a Optically transparent polymeric materials required for the encapsulation of optoelectronic chips are critical to the manufacturability, cost, performance, and reliability of LED and other optoelectronic devices. This work is focused on the development of the transparent epoxy based liquid encapsulants with the objective to enhance the manufacturability, to reduce the cost, and to improve both the performance and the reliability of the packaged optoelectronic devices.
520 $a First, three transparent encapsulants based on different chemistries were reviewed and their properties compared. These encapsulant systems serve as models of different epoxy chemistries suitable for LED applications. The experimental result gives an overview of the characteristics of each system and guides the further development of the encapsulant for different packaging needs.
520 $a Then, two new encapsulants were developed and introduced. The first one was a two-component encapsulant based on DGEBA/MHHPA chemistry, but provides lower internal stress, better transmission retention upon thermal aging, and easier processing compared with the current best performer based on the same chemistry. The second one is a novel one-component, low temperature and fast cure encapsulant with a high refractive index of 1.6. This encapsulant provides not only the easy handling, convenient storage, and energy saving, but also higher light output for the packaged LED devices.
520 $a The third part of this work deals with nanocomposites based on aromatic epoxy and cycloaliphatic epoxy. It was found that these composites provide lower CTE, better toughness, and other advantages while keeping good transparency, therefore are suitable for LED applications. Toughening is another topic studied. Three toughened transparent encapsulants were introduced and compared. The toughening agents selected effectively increased the toughness of the cycloaliphatic epoxy/MHHPA system with minimum negative effect on the transmission of the encapsulants.
520 $a The last part of this work is the optimization of the current encapsulants to meet the challenges by new processing and application requirements. The effect of ionic purity of the epoxy resin on encapsulant discoloration was studied. Generally, lower ionic purity leads to higher discoloration up on thermal aging, but the relationship is not necessary linear. However no correlation was found between the ionic purity and the discoloration upon UV aging. The effect of stoichiometric ratio on discoloration of DGEBA/MHHPA system upon thermal aging was also studied. It was found that the off-stoichiometric ratio formulation with 1.1 equivalent epoxy gave the lowest discoloration when aged at 150°C.
590 $a School code: 0030.
650 4 $a Engineering, Materials Science. $3 1017759
690 $a 0794
710 2 $a University of California, Irvine. $3 705821
773 0 $t Dissertation Abstracts International $g 69-10B.
790 $a 0030
790 1 0 $a Shi, Frank G., $e advisor
791 $a Ph.D.
792 $a 2008
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3333278