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Study of tin-silver-copper alloy rel...

Georgia Institute of Technology.

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Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry./
Author:	Tunga, Krishna Rajaram.
Description:	180 p.
Notes:	Adviser: Suresh K. Sitaraman.
Contained By:	Dissertation Abstracts International69-09B.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoeng/servlet/advanced?query=3327671
ISBN:	9780549801689

Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.
Tunga, Krishna Rajaram.

Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry. - 180 p.

Adviser: Suresh K. Sitaraman.

Thesis (Ph.D.)--Georgia Institute of Technology, 2008.

This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.

ISBN: 9780549801689Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.
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020 $a 9780549801689
035 $a (UMI)AAI3327671
035 $a AAI3327671
040 $a UMI $c UMI
100 1 $a Tunga, Krishna Rajaram. $3 1029261
245 1 0 $a Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.
300 $a 180 p.
500 $a Adviser: Suresh K. Sitaraman.
500 $a Source: Dissertation Abstracts International, Volume: 69-09, Section: B, page: 5743.
502 $a Thesis (Ph.D.)--Georgia Institute of Technology, 2008.
520 $a This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.
590 $a School code: 0078.
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0548
690 $a 0549
690 $a 0794
710 2 $a Georgia Institute of Technology. $3 696730
773 0 $t Dissertation Abstracts International $g 69-09B.
790 $a 0078
790 1 0 $a Sitaraman, Suresh K., $e advisor
791 $a Ph.D.
792 $a 2008
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoeng/servlet/advanced?query=3327671