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Mathematical models to predict the p...

Michigan State University.

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Mathematical models to predict the performance of insulating packages and their practical uses.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Mathematical models to predict the performance of insulating packages and their practical uses./
作者:	Choi, Seung-Jin.
面頁冊數:	147 p.
附註:	Adviser: Gary J. Burgess.
Contained By:	Dissertation Abstracts International65-12B.
標題:	Agriculture, Food Science and Technology. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoeng/servlet/advanced?query=3158929
ISBN:	9780496915316

Mathematical models to predict the performance of insulating packages and their practical uses.
Choi, Seung-Jin.

Mathematical models to predict the performance of insulating packages and their practical uses. - 147 p.

Adviser: Gary J. Burgess.

Thesis (Ph.D.)--Michigan State University, 2004.

Based on this model, a simplified equation was derived for the practical prediction of the thermal resistance of the entire insulating package. This equation showed dramatically improved results compared to the conventional equations.

ISBN: 9780496915316Subjects--Topical Terms:

1017813
Agriculture, Food Science and Technology.

Mathematical models to predict the performance of insulating packages and their practical uses.
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020 $a 9780496915316
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100 1 $a Choi, Seung-Jin. $3 1025151
245 1 0 $a Mathematical models to predict the performance of insulating packages and their practical uses.
300 $a 147 p.
500 $a Adviser: Gary J. Burgess.
500 $a Source: Dissertation Abstracts International, Volume: 65-12, Section: B, page: 6628.
502 $a Thesis (Ph.D.)--Michigan State University, 2004.
520 $a Based on this model, a simplified equation was derived for the practical prediction of the thermal resistance of the entire insulating package. This equation showed dramatically improved results compared to the conventional equations.
520 $a Examples of the utilization of this model are also included.
520 $a First, a computer model was developed to represent the heat transfer through multi-layered walls and an equation was derived for the calculation of the thermal resistance of the multi-layered wall.
520 $a Thermal insulation is used in variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. These factors include the heat transfer through the packaging material (conduction, convection and radiation), the geometry of the insulating package and the contact resistance between the product and the package. In this study, a comprehensive model, which includes all of these factors, was developed to predict the performance of the insulating package.
520 $a Thereafter, three mathematical models, which included the geometry of the insulating package, contact between the insulating package and product and contact between the package and the ground, were developed to investigate the heat transfer through the entire insulating package. Thermal resistances of entire packages calculated by these models were compared to ice-melt test data for evaluation. The model, which included the geometry of the insulating package and contact between the insulating package and ice container, successfully predicted experimental data within 20% error.
590 $a School code: 0128.
650 4 $a Agriculture, Food Science and Technology. $3 1017813
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0359
690 $a 0549
710 2 $a Michigan State University. $3 676168
773 0 $t Dissertation Abstracts International $g 65-12B.
790 $a 0128
790 1 0 $a Burgess, Gary J., $e advisor
791 $a Ph.D.
792 $a 2004
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