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Integrated circuit, hybrid, and mult...

Pecht, Michael.

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Integrated circuit, hybrid, and multichip module package design guidelines : = a focus on reliability /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Integrated circuit, hybrid, and multichip module package design guidelines :/ [edited by] Michael Pecht.
其他題名:	a focus on reliability /
其他作者:	Pecht, Michael.
出版者:	New York :Wiley, : c1994.,
面頁冊數:	xxxi, 426 p. :ill. ;25 cm.
附註:	"A Wiley-Interscience publication."
標題:	Electronic packaging - Design. -
ISBN:	0471594466 (cloth : alk. paper)

Integrated circuit, hybrid, and multichip module package design guidelines : = a focus on reliability /
Integrated circuit, hybrid, and multichip module package design guidelines :a focus on reliability /[edited by] Michael Pecht. - New York :Wiley,c1994. - xxxi, 426 p. :ill. ;25 cm.

"A Wiley-Interscience publication."

Includes bibliographical references and index.

ISBN: 0471594466 (cloth : alk. paper)

LCCN: 93012475Subjects--Topical Terms:

649439
Electronic packaging
--Design.

LC Class. No.: TK7870.15 / .P42 1994

Dewey Class. No.: 621.381/046

Integrated circuit, hybrid, and multichip module package design guidelines : = a focus on reliability /
LDR:00672nam a2200193 a 45 001 643509
003 DLC
005 19940411080258.7
008 930211s1994 nyua b 001 0 eng
010 $a 93012475
020 $a 0471594466 (cloth : alk. paper)
035 $a dt 00001057
040 $a DLC $c DLC $d DLC
050 0 0 $a TK7870.15 $b .P42 1994
082 0 0 $a 621.381/046 $2 20
245 0 0 $a Integrated circuit, hybrid, and multichip module package design guidelines : $b a focus on reliability / $c [edited by] Michael Pecht.
260 $a New York : $c c1994. $b Wiley,
300 $a xxxi, 426 p. : $b ill. ; $c 25 cm.
500 $a "A Wiley-Interscience publication."
504 $a Includes bibliographical references and index.
650 $a Electronic packaging $x Design. $3 649439
650 $a Hybrid integrated circuits $x Design and construction. $3 649626
650 $a Multichip modules (Microelectronics) $x Design and construction. $3 649440
700 $a Pecht, Michael. $3 623562