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微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = = Size ...

李國瑋

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微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = = Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = / 李國瑋撰
Reminder of title:	Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints /
remainder title:	Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints
Author:	李國瑋
Published:	[花蓮縣] : 國立東華大學材料科學與工程學系, : 民97[2008],
Description:	10,74面 : 圖,表 ; 30公分
Notes:	指導教授︰宋振銘
Subject:	拘束效應 -
Online resource:	http://etd.lib.ndhu.edu.tw/ETD-db/ETD-search-c/view_etd?URN=etd-0728108-203436PDF全文

微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = = Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints /
李國瑋

微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints / Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints李國瑋撰 - [花蓮縣] : 國立東華大學材料科學與工程學系, 民97[2008] - 10,74面 : 圖,表 ; 30公分

指導教授︰宋振銘

碩士論文--國立東華大學材料科學與工程學系,2008

參考書目︰面71-74Subjects--Topical Terms:

2697420
拘束效應

微電子銲點組織與機性之尺寸微小化及基材差異效應探討 = = Size and substrate effects on microstructure and mechanical properties of microelectronic solder joints /
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