Language:
English
繁體中文
Help
回圖書館首頁
手機版館藏查詢
Login
Back
Switch To:
Labeled
|
MARC Mode
|
ISBD
VLSI-SoC 2023 = innovations for trus...
~
IFIP/IEEE International Conference on Very Large Scale Integration (2023 :)
Linked to FindBook
Google Book
Amazon
博客來
VLSI-SoC 2023 = innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
Record Type:
Electronic resources : Monograph/item
Title/Author:
VLSI-SoC 2023/ edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha.
Reminder of title:
innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
other author:
Elfadel, Ibrahim M.
corporate name:
IFIP/IEEE International Conference on Very Large Scale Integration
Published:
Cham :Springer Nature Switzerland : : 2024.,
Description:
xii, 320 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:
Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect -- Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.
Contained By:
Springer Nature eBook
Subject:
Integrated circuits - Congresses. - Very large scale integration -
Online resource:
https://doi.org/10.1007/978-3-031-70947-0
ISBN:
9783031709470
VLSI-SoC 2023 = innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
VLSI-SoC 2023
innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /[electronic resource] :edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha. - Cham :Springer Nature Switzerland :2024. - xii, 320 p. :ill. (some col.), digital ;24 cm. - IFIP advances in information and communication technology,6801868-422X ;. - IFIP advances in information and communication technology ;680..
Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect -- Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.
This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
ISBN: 9783031709470
Standard No.: 10.1007/978-3-031-70947-0doiSubjects--Topical Terms:
586339
Integrated circuits
--Very large scale integration--Congresses.
LC Class. No.: TK7874
Dewey Class. No.: 621.395
VLSI-SoC 2023 = innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
LDR
:03250nmm a2200337 a 4500
001
2388827
003
DE-He213
005
20241228115236.0
006
m d
007
cr nn 008maaau
008
250916s2024 sz s 0 eng d
020
$a
9783031709470
$q
(electronic bk.)
020
$a
9783031709463
$q
(paper)
024
7
$a
10.1007/978-3-031-70947-0
$2
doi
035
$a
978-3-031-70947-0
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
TK7874
072
7
$a
UK
$2
bicssc
072
7
$a
COM067000
$2
bisacsh
072
7
$a
UK
$2
thema
082
0 4
$a
621.395
$2
23
090
$a
TK7874
$b
.I23 2023
111
2
$a
IFIP/IEEE International Conference on Very Large Scale Integration
$n
(31st :
$d
2023 :
$c
Shāriqah, United Arab Emirates)
$3
3754139
245
1 0
$a
VLSI-SoC 2023
$h
[electronic resource] :
$b
innovations for trustworthy artificial intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023 : revised extended selected papers /
$c
edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha.
260
$a
Cham :
$b
Springer Nature Switzerland :
$b
Imprint: Springer,
$c
2024.
300
$a
xii, 320 p. :
$b
ill. (some col.), digital ;
$c
24 cm.
490
1
$a
IFIP advances in information and communication technology,
$x
1868-422X ;
$v
680
505
0
$a
Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect -- Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.
520
$a
This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
650
0
$a
Integrated circuits
$x
Very large scale integration
$v
Congresses.
$3
586339
650
1 4
$a
Computer Engineering and Networks.
$3
3538504
650
2 4
$a
Software Engineering.
$3
890874
650
2 4
$a
Computer Hardware.
$3
892776
700
1
$a
Elfadel, Ibrahim M.
$q
(Abe)
$3
2195078
700
1
$a
Albasha, Lutfi.
$3
3754140
710
2
$a
SpringerLink (Online service)
$3
836513
773
0
$t
Springer Nature eBook
830
0
$a
IFIP advances in information and communication technology ;
$v
680.
$3
3754141
856
4 0
$u
https://doi.org/10.1007/978-3-031-70947-0
950
$a
Computer Science (SpringerNature-11645)
based on 0 review(s)
Location:
ALL
電子資源
Year:
Volume Number:
Items
1 records • Pages 1 •
1
Inventory Number
Location Name
Item Class
Material type
Call number
Usage Class
Loan Status
No. of reservations
Opac note
Attachments
W9499591
電子資源
11.線上閱覽_V
電子書
EB TK7874
一般使用(Normal)
On shelf
0
1 records • Pages 1 •
1
Multimedia
Reviews
Add a review
and share your thoughts with other readers
Export
pickup library
Processing
...
Change password
Login