東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

FindBook

Google Book

Amazon

博客來

Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF)./
作者:	Venkatadri, Vikram.
面頁冊數:	1 online resource (224 pages)
附註:	Source: Dissertations Abstracts International, Volume: 74-10, Section: B.
Contained By:	Dissertations Abstracts International74-10B.
標題:	Industrial engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3556850click for full text (PQDT)
ISBN:	9781267991959

Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).
Venkatadri, Vikram.

Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF). - 1 online resource (224 pages)

Source: Dissertations Abstracts International, Volume: 74-10, Section: B.

Thesis (Ph.D.)--State University of New York at Binghamton, 2012.

Includes bibliographical references

Rapidly developing field of flexible electronics is driven by increasing demands for higher levels of integration. Flexible circuit technology offers numerous advantages and most important of them are geometrical and mechanical flexibility. One approach, known as chip-on-flex, achieves higher performance and circuit density by mating flexible circuits with surface mount technology components. Industry-wide chip-on-flex packaging solutions that have been used in high volumes are Tape-Carrier-Package (TCP) and Chip-On-Film (COF). The next generation system-level packaging solution being addressed in this research is System-On-Film (SOF) technology. SOF involves the integration of a large die alongside with surface mount passive devices on a flexible substrate. SOFs can be assembled using assembly processes and materials presently used in COF packaging. SOFs offer increased functionality within a single module, which means increased test coverage, and reduced overall costs during integration at the system-level. Due to reduced total cost of ownership and other advantages, SOF technology is being considered as an evolution (advanced version) of COF. The factors that affect the development of SOF modules are design, assembly processes, handling and operating environment. The primary objective of this research is to investigate the effect of these factors on the mechanical integrity and reliability of the module. The secondary objective is to derive the design guidelines for both manufacturability and usage limitations. The fundamental understanding of the effects of design-process interaction will help in engineering an assembly process for improved module robustness. The effect of handling and operating environment factors on the module reliability are investigated using accelerated stress testing. During this research, it is found that an alternative approach is required for assessing the quality of the bonds formed during the die bonding process. Hence, this research also outlines a methodology to assess the quality of the die bonds. The complicated task of selecting the appropriate design, process, handling and operating environment can be simplified by developing a system-level investigative approach. The overall solution to the problem is developed considering realistic constraints. Also, this research is able to highlight the complex interactions between different factors affecting the mechanical integrity and reliability of the SOF module.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2023

Mode of access: World Wide Web

ISBN: 9781267991959Subjects--Topical Terms:

526216
Industrial engineering.
Subjects--Index Terms:

Large dieIndex Terms--Genre/Form:

542853
Electronic books.

Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).
LDR:03985nmm a2200421K 4500 001 2357630
005 20230725053535.5
006 m o d
007 cr mn ---uuuuu
008 241011s2012 xx obm 000 0 eng d
020 $a 9781267991959
035 $a (MiAaPQ)AAI3556850
035 $a (MiAaPQ)binghamton:11141
035 $a AAI3556850
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Venkatadri, Vikram. $3 3698163
245 1 0 $a Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).
264 0 $c 2012
300 $a 1 online resource (224 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Dissertations Abstracts International, Volume: 74-10, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Santos, Daryl L.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 2012.
504 $a Includes bibliographical references
520 $a Rapidly developing field of flexible electronics is driven by increasing demands for higher levels of integration. Flexible circuit technology offers numerous advantages and most important of them are geometrical and mechanical flexibility. One approach, known as chip-on-flex, achieves higher performance and circuit density by mating flexible circuits with surface mount technology components. Industry-wide chip-on-flex packaging solutions that have been used in high volumes are Tape-Carrier-Package (TCP) and Chip-On-Film (COF). The next generation system-level packaging solution being addressed in this research is System-On-Film (SOF) technology. SOF involves the integration of a large die alongside with surface mount passive devices on a flexible substrate. SOFs can be assembled using assembly processes and materials presently used in COF packaging. SOFs offer increased functionality within a single module, which means increased test coverage, and reduced overall costs during integration at the system-level. Due to reduced total cost of ownership and other advantages, SOF technology is being considered as an evolution (advanced version) of COF. The factors that affect the development of SOF modules are design, assembly processes, handling and operating environment. The primary objective of this research is to investigate the effect of these factors on the mechanical integrity and reliability of the module. The secondary objective is to derive the design guidelines for both manufacturability and usage limitations. The fundamental understanding of the effects of design-process interaction will help in engineering an assembly process for improved module robustness. The effect of handling and operating environment factors on the module reliability are investigated using accelerated stress testing. During this research, it is found that an alternative approach is required for assessing the quality of the bonds formed during the die bonding process. Hence, this research also outlines a methodology to assess the quality of the die bonds. The complicated task of selecting the appropriate design, process, handling and operating environment can be simplified by developing a system-level investigative approach. The overall solution to the problem is developed considering realistic constraints. Also, this research is able to highlight the complex interactions between different factors affecting the mechanical integrity and reliability of the SOF module.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2023
538 $a Mode of access: World Wide Web
650 4 $a Industrial engineering. $3 526216
650 4 $a Mechanical engineering. $3 649730
650 4 $a Systems science. $3 3168411
653 $a Large die
653 $a Next generation
653 $a Packaging
653 $a Reliability
653 $a System-on-film
655 7 $a Electronic books. $2 lcsh $3 542853
690 $a 0546
690 $a 0548
690 $a 0790
710 2 $a ProQuest Information and Learning Co. $3 783688
710 2 $a State University of New York at Binghamton. $b Industrial Engineering. $3 1035516
773 0 $t Dissertations Abstracts International $g 74-10B.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3556850 $z click for full text (PQDT)