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3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects./
作者:	Rahimnouri, Amirhossein.
面頁冊數:	1 online resource (128 pages)
附註:	Source: Masters Abstracts International, Volume: 83-06.
Contained By:	Masters Abstracts International83-06.
標題:	Electrical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28771507click for full text (PQDT)
ISBN:	9798496547581

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.
Rahimnouri, Amirhossein.

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects. - 1 online resource (128 pages)

Source: Masters Abstracts International, Volume: 83-06.

Thesis (M.A.S.)--University of Toronto (Canada), 2021.

Includes bibliographical references

An increase in data usage following demands for faster networks over past decades has prompted data centers to scale up the density of channels and boost the network bandwidth. In this way, a new architecture for assembly and packaging of electro-optical (EO) components is now required to facilitate chip-to-chip and chip-to-network interconnections. This thesis employs femtosecond laser writing combined with 3D structural micro-machining for fabricating glass interposers and a new optical printed circuit board (OPCB) platform. The presented glass interposer provided vertical coupling from a plane of multi-core fiber (MCF) arrays to a two-dimensional (2D) grid of silicon photonics (SiP) grating couplers. The OPCB platform demonstrated a wider scope for all-glass optical routing by providing a high-density optical circuit for MCF-to-MCF linking. The interposer and OPCB optical systems provided tight-turning waveguide bends for 3D interconnectivity by developing total internal reflection (TIR) mirrors and 2D hollow-filament gratings photonic crystals (PhCs).

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2023

Mode of access: World Wide Web

ISBN: 9798496547581Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Mirror-waveguide circuitsIndex Terms--Genre/Form:

542853
Electronic books.

3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects.
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500 $a Source: Masters Abstracts International, Volume: 83-06.
500 $a Advisor: Herman, Peter Robert.
502 $a Thesis (M.A.S.)--University of Toronto (Canada), 2021.
504 $a Includes bibliographical references
520 $a An increase in data usage following demands for faster networks over past decades has prompted data centers to scale up the density of channels and boost the network bandwidth. In this way, a new architecture for assembly and packaging of electro-optical (EO) components is now required to facilitate chip-to-chip and chip-to-network interconnections. This thesis employs femtosecond laser writing combined with 3D structural micro-machining for fabricating glass interposers and a new optical printed circuit board (OPCB) platform. The presented glass interposer provided vertical coupling from a plane of multi-core fiber (MCF) arrays to a two-dimensional (2D) grid of silicon photonics (SiP) grating couplers. The OPCB platform demonstrated a wider scope for all-glass optical routing by providing a high-density optical circuit for MCF-to-MCF linking. The interposer and OPCB optical systems provided tight-turning waveguide bends for 3D interconnectivity by developing total internal reflection (TIR) mirrors and 2D hollow-filament gratings photonic crystals (PhCs).
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2023
538 $a Mode of access: World Wide Web
650 4 $a Electrical engineering. $3 649834
650 4 $a Optics. $3 517925
653 $a Mirror-waveguide circuits
653 $a Silicon photonic interconnects
653 $a Optical printed circuit board
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