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Abrasive Machining under Vibration of Wire in Wiresaw Application.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Abrasive Machining under Vibration of Wire in Wiresaw Application./
作者:	Li, Liming.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2022,
面頁冊數:	197 p.
附註:	Source: Dissertations Abstracts International, Volume: 84-01, Section: B.
Contained By:	Dissertations Abstracts International84-01B.
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=29166866
ISBN:	9798835516865

Abrasive Machining under Vibration of Wire in Wiresaw Application.
Li, Liming.

Abrasive Machining under Vibration of Wire in Wiresaw Application. - Ann Arbor : ProQuest Dissertations & Theses, 2022 - 197 p.

Source: Dissertations Abstracts International, Volume: 84-01, Section: B.

Thesis (Ph.D.)--State University of New York at Stony Brook, 2022.

This item must not be sold to any third party vendors.

Wiresaws are the main equipment in semiconductor and photovoltaics manufacturing to slice wafers of different sizes from single- and poly-crystalline ingots, such as silicon, silicon carbide, sapphire, lithium niobite, etc., through abrasive machining. This dissertation investigates the fundamentals of abrasive machining processes, including free abrasive and bonded abrasive machining, with vibration in wiresaw applications. One such applications is the usage of rocking motion of wire guides as a technique in wiresawing process to improve the quality of as-sliced wafer surfaces and slicing efficiency. We study rocking motion of traveling wire through vibration analysis of axially moving wire with an oscillating boundary. The analysis illustrates that the vibration response of an axially moving wire is a superposition of a traveling wave initiated at the oscillating boundary and three reflected traveling waves between the two rocking boundaries. It is found from the model that the improvement of wafering comes from the micro-vibration of axially moving wire induced by the rocking motion, which can drive abrasives to perform machining. An experimental study was conducted to validate the capability of micro-vibration in driving abrasives to remove brittle materials from substrate surface. The material removal mechanism of free abrasive machining is illustrated as the repeated progression of formation of subsurface cracks, concatenation of cracks and chip exfoliation. The surface and subsurface features in brittle machining are also examined to correlate with the postulation using SEM and FIB microscopy. The results indicate that the material removal of brittle material is accomplished through abrasive grits carried by the tool (wire), in free or bonded manners, under the abrasive machining.

ISBN: 9798835516865Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Abrasive machining

Abrasive Machining under Vibration of Wire in Wiresaw Application.
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500 $a Source: Dissertations Abstracts International, Volume: 84-01, Section: B.
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502 $a Thesis (Ph.D.)--State University of New York at Stony Brook, 2022.
506 $a This item must not be sold to any third party vendors.
520 $a Wiresaws are the main equipment in semiconductor and photovoltaics manufacturing to slice wafers of different sizes from single- and poly-crystalline ingots, such as silicon, silicon carbide, sapphire, lithium niobite, etc., through abrasive machining. This dissertation investigates the fundamentals of abrasive machining processes, including free abrasive and bonded abrasive machining, with vibration in wiresaw applications. One such applications is the usage of rocking motion of wire guides as a technique in wiresawing process to improve the quality of as-sliced wafer surfaces and slicing efficiency. We study rocking motion of traveling wire through vibration analysis of axially moving wire with an oscillating boundary. The analysis illustrates that the vibration response of an axially moving wire is a superposition of a traveling wave initiated at the oscillating boundary and three reflected traveling waves between the two rocking boundaries. It is found from the model that the improvement of wafering comes from the micro-vibration of axially moving wire induced by the rocking motion, which can drive abrasives to perform machining. An experimental study was conducted to validate the capability of micro-vibration in driving abrasives to remove brittle materials from substrate surface. The material removal mechanism of free abrasive machining is illustrated as the repeated progression of formation of subsurface cracks, concatenation of cracks and chip exfoliation. The surface and subsurface features in brittle machining are also examined to correlate with the postulation using SEM and FIB microscopy. The results indicate that the material removal of brittle material is accomplished through abrasive grits carried by the tool (wire), in free or bonded manners, under the abrasive machining.
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