東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

FindBook

Google Book

Amazon

博客來

Two-phase heat and mass transfer in capillary porous media.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Two-phase heat and mass transfer in capillary porous media./
作者:	Ranjan, Ram.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2011,
面頁冊數:	359 p.
附註:	Source: Dissertations Abstracts International, Volume: 73-11, Section: B.
Contained By:	Dissertations Abstracts International73-11B.
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3507274
ISBN:	9781267322586

Two-phase heat and mass transfer in capillary porous media.
Ranjan, Ram.

Two-phase heat and mass transfer in capillary porous media. - Ann Arbor : ProQuest Dissertations & Theses, 2011 - 359 p.

Source: Dissertations Abstracts International, Volume: 73-11, Section: B.

Thesis (Ph.D.)--Purdue University, 2011.

Phase change heat transfer in capillary porous media is of great relevance in diverse industrial applications. Heat pipes, vapor chambers, thermosyphons and cold plates are some of the phase change devices which employ microscopic porous media and are used in the thermal management of high-power electronics. These devices realize high heat transfer rates by exploiting latent heat exchange. The increasing power density of electronic chips requires that the performance of these devices be optimized so that heat can be efficiently removed from the electronic chip while limiting the temperature differential between the chip and ambient. The efficiency of heat spreading in heat pipes and vapor chambers relies on the capillary porous medium (wick structure) used in the device. The wick structure also determines the maximum heat transport capability. The study of phase change heat and mass transfer in wick structures can lead to the optimization of wick design and improved performance of the phase-change cooling devices. In the first part of this thesis, numerical models are developed to study the heat and mass transport in wick structures at the pore scale. The microstructures are characterized on the basis of their wicking and thin-film evaporation performance by modeling the rates of evaporation from the liquid menisci formed in common wick microstructures. Evaporation at the interface is modeled by using appropriate heat and mass transfer rates obtained from kinetic theory. At higher heat inputs, nucleate boiling occurs in the wick structure causing a decrease in the wick thermal resistance and improvement in the device performance. A volume-of-fluid-based model is developed to study the growth of vapor bubbles in wick microstructures. In the second part of this thesis, a transient three-dimensional heat pipe model is developed which is suitable for predicting the hydrodynamic and thermal performance of vapor chambers at high heat flux inputs and small length scales. The influence of the wick microstructure on evaporation and condensation mass fluxes at the liquid-vapor interface is accounted for by integrating a microstructure-level evaporation model (micromodel) with the device-level model (macromodel). The effect of boiling in the wick structure at higher heat inputs on the vapor chamber performance is modeled and the model predictions are validated with experiments performed on custom-fabricated vapor chambers. The model is further utilized to optimize the performance of an ultra-thin vapor chamber. The last part of this work focuses on the design of novel wick micro- and nano-structures for performance improvement of vapor chambers. The thermal and hydrodynamic performance of micro-pillared structures are first modeled and a ten-times improvement in the maximum heat transport capability of vapor chambers is revealed. The viability of utilizing nanostructures such as carbon nanotubes (CNTs) and metallic nanowires as wick structures for heat pipes is also assessed. Using theoretical models, it is concluded that the flow resistance of nanostructures poses a major bottleneck to their use as passive flow-conveying media. An alternative design which combines the micro- and nano-level wicks is proposed which leads to a 14% decrease in the wick thermal resistance.

ISBN: 9781267322586Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Boiling

Two-phase heat and mass transfer in capillary porous media.
LDR:04491nmm a2200373 4500 001 2348701
005 20220912135636.5
008 241004s2011 ||||||||||||||||| ||eng d
020 $a 9781267322586
035 $a (MiAaPQ)AAI3507274
035 $a (MiAaPQ)purdue:13891
035 $a AAI3507274
040 $a MiAaPQ $c MiAaPQ
100 1 $a Ranjan, Ram. $3 1271831
245 1 0 $a Two-phase heat and mass transfer in capillary porous media.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2011
300 $a 359 p.
500 $a Source: Dissertations Abstracts International, Volume: 73-11, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Garimella, Suresh V.;Murthy, Jayathi Y.
502 $a Thesis (Ph.D.)--Purdue University, 2011.
520 $a Phase change heat transfer in capillary porous media is of great relevance in diverse industrial applications. Heat pipes, vapor chambers, thermosyphons and cold plates are some of the phase change devices which employ microscopic porous media and are used in the thermal management of high-power electronics. These devices realize high heat transfer rates by exploiting latent heat exchange. The increasing power density of electronic chips requires that the performance of these devices be optimized so that heat can be efficiently removed from the electronic chip while limiting the temperature differential between the chip and ambient. The efficiency of heat spreading in heat pipes and vapor chambers relies on the capillary porous medium (wick structure) used in the device. The wick structure also determines the maximum heat transport capability. The study of phase change heat and mass transfer in wick structures can lead to the optimization of wick design and improved performance of the phase-change cooling devices. In the first part of this thesis, numerical models are developed to study the heat and mass transport in wick structures at the pore scale. The microstructures are characterized on the basis of their wicking and thin-film evaporation performance by modeling the rates of evaporation from the liquid menisci formed in common wick microstructures. Evaporation at the interface is modeled by using appropriate heat and mass transfer rates obtained from kinetic theory. At higher heat inputs, nucleate boiling occurs in the wick structure causing a decrease in the wick thermal resistance and improvement in the device performance. A volume-of-fluid-based model is developed to study the growth of vapor bubbles in wick microstructures. In the second part of this thesis, a transient three-dimensional heat pipe model is developed which is suitable for predicting the hydrodynamic and thermal performance of vapor chambers at high heat flux inputs and small length scales. The influence of the wick microstructure on evaporation and condensation mass fluxes at the liquid-vapor interface is accounted for by integrating a microstructure-level evaporation model (micromodel) with the device-level model (macromodel). The effect of boiling in the wick structure at higher heat inputs on the vapor chamber performance is modeled and the model predictions are validated with experiments performed on custom-fabricated vapor chambers. The model is further utilized to optimize the performance of an ultra-thin vapor chamber. The last part of this work focuses on the design of novel wick micro- and nano-structures for performance improvement of vapor chambers. The thermal and hydrodynamic performance of micro-pillared structures are first modeled and a ten-times improvement in the maximum heat transport capability of vapor chambers is revealed. The viability of utilizing nanostructures such as carbon nanotubes (CNTs) and metallic nanowires as wick structures for heat pipes is also assessed. Using theoretical models, it is concluded that the flow resistance of nanostructures poses a major bottleneck to their use as passive flow-conveying media. An alternative design which combines the micro- and nano-level wicks is proposed which leads to a 14% decrease in the wick thermal resistance.
590 $a School code: 0183.
650 4 $a Mechanical engineering. $3 649730
653 $a Boiling
653 $a Evaporation
653 $a Heat pipes
653 $a Heat transfer
653 $a Porous media
653 $a Wick structure
690 $a 0548
710 2 $a Purdue University. $b Mechanical Engineering. $3 1019124
773 0 $t Dissertations Abstracts International $g 73-11B.
790 $a 0183
791 $a Ph.D.
792 $a 2011
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3507274