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Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays./
作者:	Macalalag, Adam James.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2021,
面頁冊數:	65 p.
附註:	Source: Masters Abstracts International, Volume: 83-02.
Contained By:	Masters Abstracts International83-02.
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28495228
ISBN:	9798535532943

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
Macalalag, Adam James.

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays. - Ann Arbor : ProQuest Dissertations & Theses, 2021 - 65 p.

Source: Masters Abstracts International, Volume: 83-02.

Thesis (M.S.)--University of Hawai'i at Manoa, 2021.

This item must not be sold to any third party vendors.

Liquid-cooled micro-pin-fin heat sink thermal design and performance assessment requires an accurate understanding and prediction of pressure drop and heat transfer associated with liquid single-phase flow in micro-pin-fin arrays. This study investigated water flow pressure drop across micro-pin-fin arrays with different geometries using numerical simulations implemented with COMSOL Multiphysics software. COMSOL simulations were modeled after an existing experimental set up (180 μm in diameter, 683 μm in height, and 399 μm in both longitudinal and transverse pitches) and previously studied numerical analyses (various height to diameter ratios) were performed. COMSOL results were compared to experimental and numerical results. Lower mean absolute error (MAE) values showed good agreement and validated the COMSOL simulations. Once validated, 2D and 3D numerical simulation of various micro-pin-fin array geometries were conducted over seven Re numbers (20, 50, 100, 215, 410, 605, 800). Various changes to transverse pin separation (Wsp), longitudinal pin separation (Lsp), and diameter were modeled and simulated. The results showed that an increase Wsp decreased friction factor and vice versa. Changes to Lsp had little effect on friction factor. Lastly, an increase in pin diameter increased friction factor. These results provide a better understanding of flow resistance and its relationship to the geometrical parameters.

ISBN: 9798535532943Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Micro-pin-fin

Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
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100 1 $a Macalalag, Adam James. $3 3686882
245 1 0 $a Numerical Simulation of Pressure Drop Across Micro-Pin-Fin Arrays.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2021
300 $a 65 p.
500 $a Source: Masters Abstracts International, Volume: 83-02.
500 $a Advisor: Qu, Weilin.
502 $a Thesis (M.S.)--University of Hawai'i at Manoa, 2021.
506 $a This item must not be sold to any third party vendors.
520 $a Liquid-cooled micro-pin-fin heat sink thermal design and performance assessment requires an accurate understanding and prediction of pressure drop and heat transfer associated with liquid single-phase flow in micro-pin-fin arrays. This study investigated water flow pressure drop across micro-pin-fin arrays with different geometries using numerical simulations implemented with COMSOL Multiphysics software. COMSOL simulations were modeled after an existing experimental set up (180 μm in diameter, 683 μm in height, and 399 μm in both longitudinal and transverse pitches) and previously studied numerical analyses (various height to diameter ratios) were performed. COMSOL results were compared to experimental and numerical results. Lower mean absolute error (MAE) values showed good agreement and validated the COMSOL simulations. Once validated, 2D and 3D numerical simulation of various micro-pin-fin array geometries were conducted over seven Re numbers (20, 50, 100, 215, 410, 605, 800). Various changes to transverse pin separation (Wsp), longitudinal pin separation (Lsp), and diameter were modeled and simulated. The results showed that an increase Wsp decreased friction factor and vice versa. Changes to Lsp had little effect on friction factor. Lastly, an increase in pin diameter increased friction factor. These results provide a better understanding of flow resistance and its relationship to the geometrical parameters.
590 $a School code: 0085.
650 4 $a Mechanical engineering. $3 649730
650 4 $a Friction. $3 650299
650 4 $a Agreements. $3 3559354
650 4 $a Heat transfer. $3 3391367
650 4 $a Simulation. $3 644748
650 4 $a Software. $2 gtt. $3 619355
650 4 $a Viscosity. $3 1050706
650 4 $a Investigations. $3 3561159
650 4 $a Flow velocity. $3 3564851
650 4 $a Symmetry. $3 536815
650 4 $a Numerical analysis. $3 517751
650 4 $a Ratios. $3 3561161
650 4 $a Arrays. $3 3681398
650 4 $a Boundary conditions. $3 3560411
650 4 $a Geometry. $3 517251
653 $a Micro-pin-fin
653 $a Heat sink
653 $a Thermal design
653 $a Heat transfer
690 $a 0548
710 2 $a University of Hawai'i at Manoa. $b Mechanical Engineering. $3 3346710
773 0 $t Masters Abstracts International $g 83-02.
790 $a 0085
791 $a M.S.
792 $a 2021
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28495228