Residual stress, thermomechanics & i...
SEM Conference & Exposition on Experimental and Applied Mechanics ((2019 :)

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  • Residual stress, thermomechanics & infrared imaging and inverse problems. = proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics /. Volume 6
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Residual stress, thermomechanics & infrared imaging and inverse problems./ edited by Antonio Baldi ... [et al.].
    其他題名: proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics /
    其他作者: Baldi, Antonio.
    團體作者: SEM Conference & Exposition on Experimental and Applied Mechanics
    出版者: Cham :Springer International Publishing : : 2020.,
    面頁冊數: viii, 169 p. :ill. (some col.), digital ;24 cm.
    內容註: 1. Regularization Uncertainty in Slitting Residual Stress Measurement -- 2. Walkthrough and History of the Virtual Fields Method -- 3. Low-Cost Thermoelastic Stress Analysis -- 4. Keynote: Residual Stresses in Biological Materials -- 5. The Effect of Residual Stress on Aluminum Strength using Thermoelatic Stress Analysis -- 6. Calibration of Anisotropic Plasticity Models with an Optimized Heterogeneous Test and the Virtual Fields Method -- 7. One-Dimensional Heat Source Reconstruction Applied to Phase Transforming Superelastic Ni-Ti Wire -- 8. Coupled NIRT/3D-DIC for a FEMU Identification of the Thermo-mechanical Behavior of Zr-4 Claddings under Simulated Reactivity Initiated Accident -- 9. Quench-induced Residual Stress in Complex Geometry: Measurement and Modeling by Eigenstrain -- 10. Residual Stresses at Critical Locations in Additively-Manufactured Components -- 11. Identification of Constitutive Parameters Governing the Hyperelastic Response of Rubber by Using Full-field Measurement and the Virtual Fields Method -- 12. Intermethod Comparison and Evaluation of Near Surface Residual Stress in Aluminum Parts Subject to Various Milling Parameters -- 13. Inversion of Residual Stresses in Silicon Wafer from Surface Deflection Measurements -- 14. Evaluating the Coefficient of Thermal Expansion of Electronic Board Using the Virtual Fields Method -- 15. Identification of Constitutive Parameters from Full Thermal and Kinematic Fields: Application to Hyperelasticity -- 16. Calorific Analysis of a Granular System made in Shape Memory Alloy -- 17. Dynamic VFM to Identify Viscoplastic Parameters. Analysis of Impact Tests on Titanium Alloy -- 18. Keynote: Test Design for Identification from Full-field Measurements: A Concise Review -- 19. Stress Determination for Granular Materials Using TSA: An Inverse Approach -- 20. Evaluation of Fatigue Crack Growth Behavior and Effect of Repair Work Based on Thermoelastic Stress Analysis for Steel Bridge Members -- 21. Analysis of Deformations in Crush Tests of Lithium Ion Battery Cells -- 22. In-situ thermal monitoring of printed components during rapid prototyping by Fused Deposition Modeling -- 23. Development of an Inverse Identification Method for Identifying Hyperelastic Constitutive Parameters by Metaheuristic Optimization Algorithm -- 24. MIMO Input Derivations, Optimizing Input Force Against Output Accuracy -- 25. Evaluation of Sensitivity-Based Virtual Fields for Non-Linear Parameter Identification Including DIC Filtering Effects -- 26. Identification of Inhomogeneous Plastic Constitutive Models of Friction Stir Welded Aluminum Alloy Sheets Using Virtual Fields Method -- 27. Accuracy Improvement of Thermoelastic Stress and Dissipation Energy Measurement by Motion Compensation with Optical-Infraredynchronous Measurement.
    Contained By: Springer eBooks
    標題: Residual stresses - Congresses. -
    電子資源: https://doi.org/10.1007/978-3-030-30098-2
    ISBN: 9783030300982
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