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Flexible electronics fabrication by ...

Ko, Seung Hwan.

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Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing./
作者:	Ko, Seung Hwan.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2006,
面頁冊數:	183 p.
附註:	Source: Dissertations Abstracts International, Volume: 68-12, Section: B.
Contained By:	Dissertations Abstracts International68-12B.
標題:	Organic chemistry. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3253929

Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing.
Ko, Seung Hwan.

Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing. - Ann Arbor : ProQuest Dissertations & Theses, 2006 - 183 p.

Source: Dissertations Abstracts International, Volume: 68-12, Section: B.

Thesis (Ph.D.)--University of California, Berkeley, 2006.

This item must not be sold to any third party vendors.

Inkjet direct writing of functional materials provides a promising pathway towards realization of ultra-low cost, large area printed electronics on polymer substrates as an alternative to the conventional integrated circuit (IC) processes, albeit at the expense of lowered resolution (∼20-50μm). Flexible polymer substrates are chemically incompatible with resists, etchant and developers used in conventional IC processing. In practice, conventional IC fabrication processes are subject to limitations, in that they are multi-step, involve high processing temperatures, toxic waste, and are therefore expensive. Our approach to overcome these problems entails introducing advanced laser processing combined with utilization of metal nanoparticles to inkjet direct printing. Metal nanoparticles are known to exhibit a large melting temperature depression due to thermodynamic size effect. Compared to the melting temperature of bulk gold (1063°C), 2∼3nm sized nanoparticles start to melt around 130∼140°C, a range that is compatible with plastic substrates. Hybrid metal nanoparticle inkjet printing combined with laser sintering could enhance the feature resolution and the conductor quality at least by one order without damaging the plastic substrate nor without using any conventional lithography processes. As a subtractive post process, it is demonstrated that by ablating unsintered nanoparticle film with short pulsed laser, problems encountered in the pulsed laser ablation of typical metal films at fluence lower than the ablation threshold of thin metal film formed from metal nanoparticle laser sintering, can be alleviated, enabling clean, precise and high resolution patterning. This further gives basis for a novel multilayer processing scheme; SPLA-DAT (selective pulsed laser ablation by differential ablation threshold). Based on the nanoparticle laser sintering and ablation process, all-inkjet printed and laser processed high quality resistors (5.4μ Ω·cm, 1∼100μm) and capacitors (1∼10pF) were demonstrated and characterized. Finally, all-inkjet printed and laser processed OFETs (organic field effect transistors, Ion/Ioff ∼ 105, μ FE ∼ 0.01 cm2/V·s, micron to submicron channel length) combined with an air stable carboxylate-functionalized polythiophene were for the first time fabricated in a fully maskless sequence, eliminating the need for any lithographic processes by SPLA-DAT process. All processing and characterization steps were carried out at plastic-compatible low temperatures and in air under ambient pressure.Subjects--Topical Terms:

523952
Organic chemistry.

Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing.
LDR:03695nmm a2200313 4500 001 2206348
005 20190829083251.5
008 201008s2006 ||||||||||||||||| ||eng d
035 $a (MiAaPQ)AAI3253929
035 $a AAI3253929
040 $a MiAaPQ $c MiAaPQ
100 1 $a Ko, Seung Hwan. $3 3433245
245 1 0 $a Flexible electronics fabrication by lithography -free low temperature metal nanoparticle laser processing.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2006
300 $a 183 p.
500 $a Source: Dissertations Abstracts International, Volume: 68-12, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Grigoropoulos, Costas P.
502 $a Thesis (Ph.D.)--University of California, Berkeley, 2006.
506 $a This item must not be sold to any third party vendors.
506 $a This item must not be added to any third party search indexes.
520 $a Inkjet direct writing of functional materials provides a promising pathway towards realization of ultra-low cost, large area printed electronics on polymer substrates as an alternative to the conventional integrated circuit (IC) processes, albeit at the expense of lowered resolution (∼20-50μm). Flexible polymer substrates are chemically incompatible with resists, etchant and developers used in conventional IC processing. In practice, conventional IC fabrication processes are subject to limitations, in that they are multi-step, involve high processing temperatures, toxic waste, and are therefore expensive. Our approach to overcome these problems entails introducing advanced laser processing combined with utilization of metal nanoparticles to inkjet direct printing. Metal nanoparticles are known to exhibit a large melting temperature depression due to thermodynamic size effect. Compared to the melting temperature of bulk gold (1063°C), 2∼3nm sized nanoparticles start to melt around 130∼140°C, a range that is compatible with plastic substrates. Hybrid metal nanoparticle inkjet printing combined with laser sintering could enhance the feature resolution and the conductor quality at least by one order without damaging the plastic substrate nor without using any conventional lithography processes. As a subtractive post process, it is demonstrated that by ablating unsintered nanoparticle film with short pulsed laser, problems encountered in the pulsed laser ablation of typical metal films at fluence lower than the ablation threshold of thin metal film formed from metal nanoparticle laser sintering, can be alleviated, enabling clean, precise and high resolution patterning. This further gives basis for a novel multilayer processing scheme; SPLA-DAT (selective pulsed laser ablation by differential ablation threshold). Based on the nanoparticle laser sintering and ablation process, all-inkjet printed and laser processed high quality resistors (5.4μ Ω·cm, 1∼100μm) and capacitors (1∼10pF) were demonstrated and characterized. Finally, all-inkjet printed and laser processed OFETs (organic field effect transistors, Ion/Ioff ∼ 105, μ FE ∼ 0.01 cm2/V·s, micron to submicron channel length) combined with an air stable carboxylate-functionalized polythiophene were for the first time fabricated in a fully maskless sequence, eliminating the need for any lithographic processes by SPLA-DAT process. All processing and characterization steps were carried out at plastic-compatible low temperatures and in air under ambient pressure.
590 $a School code: 0028.
650 4 $a Organic chemistry. $3 523952
650 4 $a Electrical engineering. $3 649834
690 $a 0490
690 $a 0544
710 2 $a University of California, Berkeley. $3 687832
773 0 $t Dissertations Abstracts International $g 68-12B.
790 $a 0028
791 $a Ph.D.
792 $a 2006
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3253929