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Study of the influence of nanosized ...

Guo, Lei.

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Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool./
作者:	Guo, Lei.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2016,
面頁冊數:	163 p.
附註:	Source: Dissertation Abstracts International, Volume: 78-07(E), Section: B.
Contained By:	Dissertation Abstracts International78-07B(E).
標題:	Mechanical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10392787
ISBN:	9781369591361

Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool.
Guo, Lei.

Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool. - Ann Arbor : ProQuest Dissertations & Theses, 2016 - 163 p.

Source: Dissertation Abstracts International, Volume: 78-07(E), Section: B.

Thesis (Ph.D.)--The University of Toledo, 2016.

As one of the most broadly employed machining process, abrasive machining is a complex material removal process in which a number of abrasive grains randomly cut material off from the workpiece. Common examples including grinding, lapping, honing and polishing can be all categorized to abrasive machining process. In the manufacturing of abrasive tools like grinding wheel and lapping plate, two of the most significant components are primarily considered: the abrasive grain and the bonding agent. Abrasive grains are usually selected from Aluminum oxide, Silicon carbide, Diamond and CBN in modern industry, while metal bonding agent and resin bonding agent is the most widely used matrix material.

ISBN: 9781369591361Subjects--Topical Terms:

649730
Mechanical engineering.

Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool.
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245 1 0 $a Study of the influence of nanosized filler on the UV light-curable resin bonded abrasive tool.
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300 $a 163 p.
500 $a Source: Dissertation Abstracts International, Volume: 78-07(E), Section: B.
500 $a Adviser: Ioan Marinescu.
502 $a Thesis (Ph.D.)--The University of Toledo, 2016.
520 $a As one of the most broadly employed machining process, abrasive machining is a complex material removal process in which a number of abrasive grains randomly cut material off from the workpiece. Common examples including grinding, lapping, honing and polishing can be all categorized to abrasive machining process. In the manufacturing of abrasive tools like grinding wheel and lapping plate, two of the most significant components are primarily considered: the abrasive grain and the bonding agent. Abrasive grains are usually selected from Aluminum oxide, Silicon carbide, Diamond and CBN in modern industry, while metal bonding agent and resin bonding agent is the most widely used matrix material.
520 $a Thanks to a remarkable development on rapid prototyping, the ultraviolet (UV) curing technology has been applied at a wide range in manufacturing. In this research, the UV curing techniques was introduced into the fabrication of resin bond abrasive tool. In order to optimize the time consuming, reduce the energy cost of the traditional manufacturing process and improve the machining performance of the tool, the thermosetting resin agent was replaced with UV light-curable resin.
520 $a To verify the manufacturing feasibility and examine the machining performance of the tool, an UV light-curable resin bond grinding wheel was developed with diamond as the abrasive grain. A group of comparative experiments on ceramic workpiece was carried out to study the machining capacity of the tool, in terms of surface finishing and material stock removal. Moreover, nanosized alumina particle was selected as a filler additive in the manufacturing process in order to improve the material properties of the resin matrix, and strengthen the bonding between the matrix and the diamond grain. Interestingly, the result showed that the utilization of nanosized alumina filler influenced not just the manufacturing of the tool, but also the performance of the tool in a very positive way.
520 $a In order to determine the influence of filler loading on the bonding mechanism of each single diamond grain, a theoretical force model was established based on elastic mechanics to quantitatively describe the retention capability of the resin matrix, in terms of compressive stress generated from the shrinkage of resin. Because of the micron scale of diamond grains in resin matrix, it is hard to experimentally verify this force model. Therefore, a numerical model was also developed based on FEM simulation to validate the reliability of above-mentioned force model. A series of calculation and simulation were carried out to comparatively study the retention force on each diamond grain in pure resin matrix and filler loaded resin matrix. The results obtained are consistent with reasonable errors that could be explained by the difference in application conditions of each model. From a perspective of process prediction, these models could provide not just a direct output including matrix volume shrinkage and compressive force generated on each diamond grit, but also an indirect output as the tool's machining capacity that largely determined by diamond retention.
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