東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Nanoparticle generation and interact...

Khopkar, Yashdeep.

FindBook

Google Book

Amazon

博客來

Nanoparticle generation and interactions with surfaces in vacuum systems.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Nanoparticle generation and interactions with surfaces in vacuum systems./
作者:	Khopkar, Yashdeep.
面頁冊數:	215 p.
附註:	Source: Dissertation Abstracts International, Volume: 76-12(E), Section: B.
Contained By:	Dissertation Abstracts International76-12B(E).
標題:	Nanoscience. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3717022
ISBN:	9781321963328

Nanoparticle generation and interactions with surfaces in vacuum systems.
Khopkar, Yashdeep.

Nanoparticle generation and interactions with surfaces in vacuum systems. - 215 p.

Source: Dissertation Abstracts International, Volume: 76-12(E), Section: B.

Thesis (Ph.D.)--State University of New York at Albany, 2015.

Extreme ultraviolet lithography (EUVL) is the most likely candidate as the next generation technology beyond immersion lithography to be used in high volume manufacturing in the semiconductor industry. One of the most problematic areas in the development process is the fabrication of mask blanks used in EUVL. As the masks are reflective, there is a chance that any surface aberrations in the form of bumps or pits could be printed on the silicon wafers. There is a strict tolerance to the number density of such defects on the mask that can be used in the final printing process. Bumps on the surface could be formed when particles land on the mask blank surface during the deposition of multiple bi-layers of molybdenum and silicon. To identify, and possibly mitigate the source of particles during mask fabrication, SEMATECH investigated particle generation in the VEECO Nexus deposition tool. They found several sources of particles inside the tool such as valves. To quantify the particle generation from vacuum components, a test bench suitable for evaluating particle generation in the sub-100 nm particle size range was needed.

ISBN: 9781321963328Subjects--Topical Terms:

587832
Nanoscience.

Nanoparticle generation and interactions with surfaces in vacuum systems.
LDR:05919nmm a2200301 4500 001 2066811
005 20160204121827.5
008 170521s2015 ||||||||||||||||| ||eng d
020 $a 9781321963328
035 $a (MiAaPQ)AAI3717022
035 $a AAI3717022
040 $a MiAaPQ $c MiAaPQ
100 1 $a Khopkar, Yashdeep. $3 3181663
245 1 0 $a Nanoparticle generation and interactions with surfaces in vacuum systems.
300 $a 215 p.
500 $a Source: Dissertation Abstracts International, Volume: 76-12(E), Section: B.
500 $a Adviser: Gregory Denbeaux.
502 $a Thesis (Ph.D.)--State University of New York at Albany, 2015.
520 $a Extreme ultraviolet lithography (EUVL) is the most likely candidate as the next generation technology beyond immersion lithography to be used in high volume manufacturing in the semiconductor industry. One of the most problematic areas in the development process is the fabrication of mask blanks used in EUVL. As the masks are reflective, there is a chance that any surface aberrations in the form of bumps or pits could be printed on the silicon wafers. There is a strict tolerance to the number density of such defects on the mask that can be used in the final printing process. Bumps on the surface could be formed when particles land on the mask blank surface during the deposition of multiple bi-layers of molybdenum and silicon. To identify, and possibly mitigate the source of particles during mask fabrication, SEMATECH investigated particle generation in the VEECO Nexus deposition tool. They found several sources of particles inside the tool such as valves. To quantify the particle generation from vacuum components, a test bench suitable for evaluating particle generation in the sub-100 nm particle size range was needed.
520 $a The Nanoparticle test bench at SUNY Polytechnic Institute was developed as a sub-set of the overall SEMATECH suite of metrology tools used to identify and quantify sources of particles inside process tools that utilize these components in the semiconductor industry. Vacuum valves were tested using the test bench to investigate the number, size and possible sources of particles inside the valves. Ideal parameters of valve operation were also investigated using a 300-mm slit valve with the end goal of finding optimized parameters for minimum particle generation.
520 $a SEMATECH also pursued the development of theoretical models of particle transport replicating the expected conditions in an ion beam deposition chamber assuming that the particles were generated. In the case of the ion beam deposition tool used in the mask blank fabrication process, the ion beam in the tool could significantly accelerate particles. Assuming that these particles are transported to various surfaces inside the deposition tool, the next challenge is to enhance the adhesion of the particles on surfaces that are located in the non-critical areas inside the tool. However, for particles in the sub-100 nm size range, suitable methods do not exist that can compare the adhesion probability of particles upon impact for a wide range of impact velocities, surfaces and particle types. Traditional methods, which rely on optical measurement of particle velocities in the micron-size regime, cannot be used for sub-100 nm particles as the particles do not scatter sufficient light for the detectors to function. All the current methods rely on electrical measurements taken from impacting particles onto a surface. However, for sub-100 nm particles, the impact velocity varies in different regions of the same impaction spot. Therefore, electrical measurements are inadequate to quantify the exact adhesion characteristics at different impact velocities to enable a comparison of multiple particle-surface systems.
520 $a Therefore, we propose a new method based on the use of scanning electron microscopy (SEM) imaging to study the adhesion of particles upon impact on surfaces. The use of SEM imaging allows for single particle detection across a single impaction spot and, therefore, enables the comparison of different regions with different impact velocities in a single impaction spot. The proposed method will provide comprehensive correlation between the adhesion probability of sub-100 nm particles and a wide range of impact velocities and angles. The location of each particle is compared with impact velocity predicted by using computational fluid dynamics methods to generate a comprehensive adhesion map involving the impact of 70 nm particles on a polished surface across a large impact velocity range. The final adhesion probability map shows higher adhesion at oblique impact angles compared to normal incidence impacts. Theoretical and experiments with micron-sized particles have shown that the contact area between the particle and the surface decreases at lower incidence angles which results in a decrease in the adhesion probability of the particle. The most likely cause of this result was the role of plastic deformation of particles and its effect on adhesion. Therefore, 70 nm sucrose particles were also impacted under similar impaction conditions to compare the role of plastic deformation on the adhesion characteristics of a particle. Sucrose particles have approximately 10 times more modulus of elasticity than Polystyrene Latex (PSL) particles and were found to have almost no adhesion on the surface at the same impact velocities where the highest adhesion of PSL particles was measured. Besides the role of plastic deformation, the influence of other possible errors in this process was investigated but not found to be significant. (Abstract shortened by UMI.).
590 $a School code: 0668.
650 4 $a Nanoscience. $3 587832
690 $a 0565
710 2 $a State University of New York at Albany. $b Nanoscale Science and Engineering-Nanoscale Science. $3 1685320
773 0 $t Dissertation Abstracts International $g 76-12B(E).
790 $a 0668
791 $a Ph.D.
792 $a 2015
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3717022