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Fundamentals of lead-free solder int...

Lee, Tae-Kyu.

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Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Fundamentals of lead-free solder interconnect technology/ by Tae-Kyu Lee ... [et al.].
其他題名:	from microstructures to reliability /
其他作者:	Lee, Tae-Kyu.
出版者:	Boston, MA :Springer US : : 2015.,
面頁冊數:	xiii, 253 p. :ill., digital ;24 cm.
內容註:	Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
Contained By:	Springer eBooks
標題:	Lead-free electronics manufacturing processes. -
電子資源:	http://dx.doi.org/10.1007/978-1-4614-9266-5
ISBN:	9781461492665 (electronic bk.)

Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
Fundamentals of lead-free solder interconnect technologyfrom microstructures to reliability /[electronic resource] :by Tae-Kyu Lee ... [et al.]. - Boston, MA :Springer US :2015. - xiii, 253 p. :ill., digital ;24 cm.

Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering

ISBN: 9781461492665 (electronic bk.)

Standard No.: 10.1007/978-1-4614-9266-5doiSubjects--Topical Terms:

1005111
Lead-free electronics manufacturing processes.

LC Class. No.: TK7836

Dewey Class. No.: 621.381

Fundamentals of lead-free solder interconnect technology = from microstructures to reliability /
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505 0 $a Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
520 $a This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
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