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Dry etching technology for semicondu...

Nojiri, Kazuo.

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Dry etching technology for semiconductors

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Dry etching technology for semiconductors/ by Kazuo Nojiri.
作者:	Nojiri, Kazuo.
出版者:	Cham :Springer International Publishing : : 2015.,
面頁冊數:	xiii, 116 p. :ill., digital ;24 cm.
內容註:	Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit -- Mechanism of Dry Etching -- Dry Etching of Various Materials -- Dry Etching Equipments -- Dry Etching Damage -- Latest Dry Etching Technologies -- Future Challenges and Outlook for Dry Etching Technology.
Contained By:	Springer eBooks
標題:	Plasma etching. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-10295-5
ISBN:	9783319102955 (electronic bk.)

Dry etching technology for semiconductors
Nojiri, Kazuo.

Dry etching technology for semiconductors[electronic resource] /by Kazuo Nojiri. - Cham :Springer International Publishing :2015. - xiii, 116 p. :ill., digital ;24 cm.

Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit -- Mechanism of Dry Etching -- Dry Etching of Various Materials -- Dry Etching Equipments -- Dry Etching Damage -- Latest Dry Etching Technologies -- Future Challenges and Outlook for Dry Etching Technology.

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies; Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations; Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material; Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used; Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma).

ISBN: 9783319102955 (electronic bk.)

Standard No.: 10.1007/978-3-319-10295-5doiSubjects--Topical Terms:

712111
Plasma etching.

LC Class. No.: TA2020

Dewey Class. No.: 621.044

Dry etching technology for semiconductors
LDR:03095nmm a2200313 a 4500 001 1993095
003 DE-He213
005 20150617112236.0
006 m d
007 cr nn 008maaau
008 151019s2015 gw s 0 eng d
020 $a 9783319102955 (electronic bk.)
020 $a 9783319102948 (paper)
024 7 $a 10.1007/978-3-319-10295-5 $2 doi
035 $a 978-3-319-10295-5
040 $a GP $c GP
041 0 $a eng
050 4 $a TA2020
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 621.044 $2 23
090 $a TA2020 $b .N784 2015
100 1 $a Nojiri, Kazuo. $3 2131095
245 1 0 $a Dry etching technology for semiconductors $h [electronic resource] / $c by Kazuo Nojiri.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a xiii, 116 p. : $b ill., digital ; $c 24 cm.
505 0 $a Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit -- Mechanism of Dry Etching -- Dry Etching of Various Materials -- Dry Etching Equipments -- Dry Etching Damage -- Latest Dry Etching Technologies -- Future Challenges and Outlook for Dry Etching Technology.
520 $a This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies; Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations; Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material; Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used; Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma).
650 0 $a Plasma etching. $3 712111
650 0 $a Semiconductors $x Etching. $3 837117
650 1 4 $a Engineering. $3 586835
650 2 4 $a Circuits and Systems. $3 896527
650 2 4 $a Electronic Circuits and Devices. $3 1245773
650 2 4 $a Semiconductors. $3 516162
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-10295-5
950 $a Engineering (Springer-11647)