東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Fundamentals of solder interconnect ...

Kang, Suk Chae.

FindBook

Google Book

Amazon

博客來

Fundamentals of solder interconnect wetting.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Fundamentals of solder interconnect wetting./
作者:	Kang, Suk Chae.
面頁冊數:	187 p.
附註:	Source: Dissertation Abstracts International, Volume: 64-03, Section: B, page: 1453.
Contained By:	Dissertation Abstracts International64-03B.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3084963

Fundamentals of solder interconnect wetting.
Kang, Suk Chae.

Fundamentals of solder interconnect wetting. - 187 p.

Source: Dissertation Abstracts International, Volume: 64-03, Section: B, page: 1453.

Thesis (Ph.D.)--Georgia Institute of Technology, 2003.

The dynamics of solder wetting on the metallic substrate is investigated based on the integration of broad scientific knowledge and experimental results. Supposing that the target system as a molten solder sphere wetting on the metallic substrate without occurrence of oxide on the surface of the solder and the substrate, the driving force of solder wetting is identified as a surface tension imbalance and the potential physical factors that limit solder wetting dynamics are determined as a viscous dissipation, a molecular kinetic motion, chemical reaction, and diffusion. The experimental setup and experimental methods are specially designed and developed to measure the time dependent behavior of a molten solder wetting in the isothermal condition. The experimental results show the velocity of the triple contact line during wetting clearly depends on temperature, solder materials, and substrate materials but does not depend significantly on the type of flux and the size of a solder sphere. Based on the evaluation of four previous wetting models that consider one of the potential limiting factors as a dominant process with experimental results, a closed form model that predicts the dynamics of a molten solder wetting on the metallic substrate is proposed. The model fits the experimental results very well. Since a solid solder sphere melts and the molten solder simultaneously wets the substrate during the reflow process, the melting model is developed and combined to the wetting dynamics. The experimental observation confirms the importance of a melting process during wetting and verifies the validity of the model. Design guidelines for the reflow time with substrate design parameters and process design parameters are presented based on the verified models.Subjects--Topical Terms:

783786
Engineering, Mechanical.

Fundamentals of solder interconnect wetting.
LDR:02645nmm 2200277 4500 001 1866046
005 20041220114118.5
008 130614s2003 eng d
035 $a (UnM)AAI3084963
035 $a AAI3084963
040 $a UnM $c UnM
100 1 $a Kang, Suk Chae. $3 1953462
245 1 0 $a Fundamentals of solder interconnect wetting.
300 $a 187 p.
500 $a Source: Dissertation Abstracts International, Volume: 64-03, Section: B, page: 1453.
500 $a Director: Daniel F. Baldwin.
502 $a Thesis (Ph.D.)--Georgia Institute of Technology, 2003.
520 $a The dynamics of solder wetting on the metallic substrate is investigated based on the integration of broad scientific knowledge and experimental results. Supposing that the target system as a molten solder sphere wetting on the metallic substrate without occurrence of oxide on the surface of the solder and the substrate, the driving force of solder wetting is identified as a surface tension imbalance and the potential physical factors that limit solder wetting dynamics are determined as a viscous dissipation, a molecular kinetic motion, chemical reaction, and diffusion. The experimental setup and experimental methods are specially designed and developed to measure the time dependent behavior of a molten solder wetting in the isothermal condition. The experimental results show the velocity of the triple contact line during wetting clearly depends on temperature, solder materials, and substrate materials but does not depend significantly on the type of flux and the size of a solder sphere. Based on the evaluation of four previous wetting models that consider one of the potential limiting factors as a dominant process with experimental results, a closed form model that predicts the dynamics of a molten solder wetting on the metallic substrate is proposed. The model fits the experimental results very well. Since a solid solder sphere melts and the molten solder simultaneously wets the substrate during the reflow process, the melting model is developed and combined to the wetting dynamics. The experimental observation confirms the importance of a melting process during wetting and verifies the validity of the model. Design guidelines for the reflow time with substrate design parameters and process design parameters are presented based on the verified models.
590 $a School code: 0078.
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0548
690 $a 0794
690 $a 0549
710 2 0 $a Georgia Institute of Technology. $3 696730
773 0 $t Dissertation Abstracts International $g 64-03B.
790 1 0 $a Baldwin, Daniel F., $e advisor
790 $a 0078
791 $a Ph.D.
792 $a 2003
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3084963