語系:
繁體中文
English
說明(常見問題)
回圖書館首頁
手機版館藏查詢
登入
回首頁
切換:
標籤
|
MARC模式
|
ISBD
Modeling and design of a novel cooli...
~
Wu, Tao.
FindBook
Google Book
Amazon
博客來
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams./
作者:
Wu, Tao.
面頁冊數:
224 p.
附註:
Source: Dissertation Abstracts International, Volume: 64-11, Section: B, page: 5753.
Contained By:
Dissertation Abstracts International64-11B.
標題:
Engineering, Mechanical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3112815
ISBN:
0496603116
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams.
Wu, Tao.
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams.
- 224 p.
Source: Dissertation Abstracts International, Volume: 64-11, Section: B, page: 5753.
Thesis (Ph.D.)--North Carolina State University, 2003.
As thermal management in microelectronics becomes more and more important in insuring the reliable operation, a novel and effective cooling device by smart materials such as piezoelectric bimorph needs to be developed. Investigation of modeling and design of piezoelectric resonating structures was conducted. A dynamic performance prediction method was proposed to calculate tip deflections at resonances and investigate the effect of finite stiffness bonding layer in piezoelectric bimorph. Considering the product of resonance frequency and dynamic tip deflection as a performance merit, the effects of length and location of the actuators on passive piezoelectric structures as well as the boundary conditions were analyzed for generating acoustic streaming which may be used for cooling microelectronic components.
ISBN: 0496603116Subjects--Topical Terms:
783786
Engineering, Mechanical.
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams.
LDR
:03145nmm 2200277 4500
001
1843304
005
20051010101939.5
008
130614s2003 eng d
020
$a
0496603116
035
$a
(UnM)AAI3112815
035
$a
AAI3112815
040
$a
UnM
$c
UnM
100
1
$a
Wu, Tao.
$3
1271259
245
1 0
$a
Modeling and design of a novel cooling device for microelectronics using piezoelectric resonating beams.
300
$a
224 p.
500
$a
Source: Dissertation Abstracts International, Volume: 64-11, Section: B, page: 5753.
500
$a
Chairman: Paul I. Ro.
502
$a
Thesis (Ph.D.)--North Carolina State University, 2003.
520
$a
As thermal management in microelectronics becomes more and more important in insuring the reliable operation, a novel and effective cooling device by smart materials such as piezoelectric bimorph needs to be developed. Investigation of modeling and design of piezoelectric resonating structures was conducted. A dynamic performance prediction method was proposed to calculate tip deflections at resonances and investigate the effect of finite stiffness bonding layer in piezoelectric bimorph. Considering the product of resonance frequency and dynamic tip deflection as a performance merit, the effects of length and location of the actuators on passive piezoelectric structures as well as the boundary conditions were analyzed for generating acoustic streaming which may be used for cooling microelectronic components.
520
$a
The cooling effects generated by vibrating non-slot and slotted piezoelectric bimorphs were experimentally investigated. Validated finite element analyses were employed to simulate the vibration characteristics including the natural frequencies and mode shapes of different bimorph structures. Setting the operation frequency at the fundamental resonance frequency, the cooling effects were measured by the temperature drops of the heat source above the vibrating bimorph. Air flow patterns around the bimorph actuator were visualized using particle tracking velocimetry (PTV) as well. The experiments showed that there exists an optimal gap between the heat source and the vibrating bimorph which brings the maximum temperature drop and the cooling effect increases with the electric field strength. The enhancement of heat transfer between the heat source and the non-slot bimorph can be up to 210% with the acoustic streaming generated by the bimorph vibration. The presence of slots in the bimorphs may enhance the mixing of streams outside and inside the channel resulting in an amplified heat transfer performance. However, the number, location and size of slots may influence the vibration characteristics and the formation of swirling streaming. Finally, the heat transfer coefficient of the prototyped cooling device in terms of mean Nusselt number was correlated as a function of streaming Reynolds number.
590
$a
School code: 0155.
650
4
$a
Engineering, Mechanical.
$3
783786
690
$a
0548
710
2 0
$a
North Carolina State University.
$3
1018772
773
0
$t
Dissertation Abstracts International
$g
64-11B.
790
1 0
$a
Ro, Paul I.,
$e
advisor
790
$a
0155
791
$a
Ph.D.
792
$a
2003
856
4 0
$u
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3112815
筆 0 讀者評論
館藏地:
全部
電子資源
出版年:
卷號:
館藏
1 筆 • 頁數 1 •
1
條碼號
典藏地名稱
館藏流通類別
資料類型
索書號
使用類型
借閱狀態
預約狀態
備註欄
附件
W9192818
電子資源
11.線上閱覽_V
電子書
EB
一般使用(Normal)
在架
0
1 筆 • 頁數 1 •
1
多媒體
評論
新增評論
分享你的心得
Export
取書館
處理中
...
變更密碼
登入