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A thermodynamic damage mechanics the...

Tang, Hong.

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A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints./
作者:	Tang, Hong.
面頁冊數:	289 p.
附註:	Source: Dissertation Abstracts International, Volume: 64-01, Section: B, page: 0278.
Contained By:	Dissertation Abstracts International64-01B.
標題:	Applied Mechanics. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3076534
ISBN:	049396889X

A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints.
Tang, Hong.

A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints. - 289 p.

Source: Dissertation Abstracts International, Volume: 64-01, Section: B, page: 0278.

Thesis (Ph.D.)--State University of New York at Buffalo, 2003.

A damage coupled thermo-viscoplastic constitutive model has been developed to predict thermomechanical fatigue life of eutectic Pb/Sn solder joints in microelectronics packaging. The damage, as an internal state variable with evolution function, corresponds to microstructure degradation. The damage coupled constitutive model reflects the interaction between damage and mechanical response of material under fatigue loading. The entropy, which is a measure of the disorder of thermodynamic system, is used as the metric of material damage.

ISBN: 049396889XSubjects--Topical Terms:

1018410
Applied Mechanics.

A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints.
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245 1 2 $a A thermodynamic damage mechanics theory and experimental verification for thermomechanical fatigue life prediction of microelectronics solder joints.
300 $a 289 p.
500 $a Source: Dissertation Abstracts International, Volume: 64-01, Section: B, page: 0278.
500 $a Adviser: Cemal Basaran.
502 $a Thesis (Ph.D.)--State University of New York at Buffalo, 2003.
520 $a A damage coupled thermo-viscoplastic constitutive model has been developed to predict thermomechanical fatigue life of eutectic Pb/Sn solder joints in microelectronics packaging. The damage, as an internal state variable with evolution function, corresponds to microstructure degradation. The damage coupled constitutive model reflects the interaction between damage and mechanical response of material under fatigue loading. The entropy, which is a measure of the disorder of thermodynamic system, is used as the metric of material damage.
520 $a The time and temperature dependent material parameters of eutectic Pb/Sn solder alloys involved in the constitutive model have been experimentally determined. And the damage coupled constitutive model has been programmed as user-defined subroutines and implemented into nonlinear finite element procedure of ABAQUS for numerical simulation.
520 $a Thermal and isothermal validation testing have been performed using test vehicle and actual microelectronics packaging module. The numerical model and simulation procedure have been verified by monotonic uniaxial tensile testing and monotonic shear testing under different temperatures and strain rates, isothermal cyclic shear testing, and thermal cycling of actual BGA microelectronics packages.
590 $a School code: 0656.
650 4 $a Applied Mechanics. $3 1018410
650 4 $a Engineering, Mechanical. $3 783786
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710 2 0 $a State University of New York at Buffalo. $3 1017814
773 0 $t Dissertation Abstracts International $g 64-01B.
790 1 0 $a Basaran, Cemal, $e advisor
790 $a 0656
791 $a Ph.D.
792 $a 2003
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