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Reliability evaluation of stacked di...

Song, Bo.

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Reliability evaluation of stacked die BGA assemblies under mechanical bending loads.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Reliability evaluation of stacked die BGA assemblies under mechanical bending loads./
作者:	Song, Bo.
面頁冊數:	95 p.
附註:	Source: Masters Abstracts International, Volume: 45-02, page: 1059.
Contained By:	Masters Abstracts International45-02.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1439143
ISBN:	9780542959899

Reliability evaluation of stacked die BGA assemblies under mechanical bending loads.
Song, Bo.

Reliability evaluation of stacked die BGA assemblies under mechanical bending loads. - 95 p.

Source: Masters Abstracts International, Volume: 45-02, page: 1059.

Thesis (M.S.)--University of Maryland, College Park, 2006.

This thesis presents a reliability evaluation of stacked die ball grid array (BGA) assemblies under mechanical bending loads. During assembly and use conditions, it is not uncommon for these products to be subject to dynamic bending loads. It is therefore necessary to understand how stacked die BGA assemblies respond to dynamic loads.

ISBN: 9780542959899Subjects--Topical Terms:

783786
Engineering, Mechanical.

Reliability evaluation of stacked die BGA assemblies under mechanical bending loads.
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100 1 $a Song, Bo. $3 1531319
245 1 0 $a Reliability evaluation of stacked die BGA assemblies under mechanical bending loads.
300 $a 95 p.
500 $a Source: Masters Abstracts International, Volume: 45-02, page: 1059.
500 $a Adviser: Michael G. Pecht.
502 $a Thesis (M.S.)--University of Maryland, College Park, 2006.
520 $a This thesis presents a reliability evaluation of stacked die ball grid array (BGA) assemblies under mechanical bending loads. During assembly and use conditions, it is not uncommon for these products to be subject to dynamic bending loads. It is therefore necessary to understand how stacked die BGA assemblies respond to dynamic loads.
520 $a The test specimens used in this investigation were four die stacked BGAs assembled on printed circuit boards (PCBs) with eutectic tin-lead solder and gold over nickel finishes, both as-reflowed and after aging. The failure envelopes of both types of specimen were quantified in terms of PCB flexural strain and strain rate. The experimental data from cyclic bending tests at three strain amplitudes with a constant strain rate have been used to determine the effect of strain amplitudes on cycles to failure. The experimental data from cyclic bending tests were combined with the data from impact tests to determine the effect of strain rate to cycles to failure. For the aged specimens, the relationship between durability and PCB flexural strain and strain rate was determined using an existing power law model. It shows that durability is strongly dependent on strain and weakly dependent on strain rate within the range of conditions studied. The failure sites associated with each test condition were identified, and failure site transition phenomena are reported and discussed.
590 $a School code: 0117.
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0548
710 2 0 $a University of Maryland, College Park. $3 657686
773 0 $t Masters Abstracts International $g 45-02.
790 1 0 $a Pecht, Michael G., $e advisor
790 $a 0117
791 $a M.S.
792 $a 2006
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1439143