Thermomechanical analysis and fatigu...
Bhandarkar, Sarvotham M.

Linked to FindBook      Google Book      Amazon      博客來     
  • Thermomechanical analysis and fatigue life prediction of plated-through-holes in multilayered printed wiring boards.
  • Record Type: Electronic resources : Monograph/item
    Title/Author: Thermomechanical analysis and fatigue life prediction of plated-through-holes in multilayered printed wiring boards./
    Author: Bhandarkar, Sarvotham M.
    Description: 188 p.
    Notes: Source: Dissertation Abstracts International, Volume: 53-07, Section: B, page: 3720.
    Contained By: Dissertation Abstracts International53-07B.
    Subject: Engineering, Mechanical. -
    Online resource: http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9234526
Location:  Year:  Volume Number: 
Items
  • 1 records • Pages 1 •
  • 1 records • Pages 1 •
Multimedia
Reviews
Export
pickup library
 
 
Change password
Login