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Basic and applied studies of electri...

Li, Li.

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Basic and applied studies of electrically conductive adhesives.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Basic and applied studies of electrically conductive adhesives./
作者:	Li, Li.
面頁冊數:	213 p.
附註:	Source: Dissertation Abstracts International, Volume: 57-03, Section: B, page: 2023.
Contained By:	Dissertation Abstracts International57-03B.
標題:	Engineering, Electronics and Electrical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9623213

Basic and applied studies of electrically conductive adhesives.
Li, Li.

Basic and applied studies of electrically conductive adhesives. - 213 p.

Source: Dissertation Abstracts International, Volume: 57-03, Section: B, page: 2023.

Thesis (Ph.D.)--State University of New York at Binghamton, 1995.

The electrical properties of isotropically electrical conductive adhesives were studied in this dissertation from the bulk materials to the actual adhesive joints for the surface mount applications. The material properties including thermal analysis, rheology, and microstructure were investigated. Electrical reliability in 85Subjects--Topical Terms:

626636
Engineering, Electronics and Electrical.

Basic and applied studies of electrically conductive adhesives.
LDR:02771nmm 2200289 4500 001 1828439
005 20071030074143.5
008 130610s1995 eng d
035 $a (UMI)AAI9623213
035 $a AAI9623213
040 $a UMI $c UMI
100 1 $a Li, Li. $3 1036040
245 1 0 $a Basic and applied studies of electrically conductive adhesives.
300 $a 213 p.
500 $a Source: Dissertation Abstracts International, Volume: 57-03, Section: B, page: 2023.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 1995.
520 $a The electrical properties of isotropically electrical conductive adhesives were studied in this dissertation from the bulk materials to the actual adhesive joints for the surface mount applications. The material properties including thermal analysis, rheology, and microstructure were investigated. Electrical reliability in 85 $\ sp\circ
520 $a High frequency impedance tests demonstrate the metallic behavior of these composites, and no capacitive effects between the silver flakes are seen. DC electrical measurement does not show any non-ohmic behavior. Metallic conduction is the dominant conduction mechanism in the completely cured materials. The contact resistances between the silver flakes are the controlling factors for the electrical conduction development during cure. They change from the insulating to tunneling, and finally to metallic conduction associated with the decomposition of the acid layer on the flakes and breakage of tarnish films. The temperature coefficient of the resistivity (TCR) is closely related to the silver flake sizes and distributions. The adhesives filled with smaller particles have more contacts and lower TCRs.
520 $a Cure studies show that inadequate cure schedules are suggested by the manufacturers. Cure models were developed which established the cure kinetics of these materials for choosing optimum cure schedules. Cure temperature is the main parameter to ensure full cure. Computer simulations were performed to predict the percolation thresholds and resistivities of the composites with filler sizes, distributions, and contact effects, in addition to the silver flake alignment effects.
520 $a The variations of electrical properties with process parameters of anisotropic Z-axis adhesive films were studied. Computer programs based on the microstructural investigations were developed to predict the limiting pitch application for commercial films, and for the inverse selection process.
590 $a School code: 0792.
650 4 $a Engineering, Electronics and Electrical. $3 626636
650 4 $a Engineering, Packaging. $3 1025152
650 4 $a Engineering, Materials Science. $3 1017759
690 $a 0544
690 $a 0549
690 $a 0794
710 2 0 $a State University of New York at Binghamton. $3 737493
773 0 $t Dissertation Abstracts International $g 57-03B.
790 $a 0792
791 $a Ph.D.
792 $a 1995
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9623213