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Microfluidic technology for integrat...
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Wang, Yong.
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Microfluidic technology for integrated thermal management: Micromachined synthetic jet.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Microfluidic technology for integrated thermal management: Micromachined synthetic jet./
作者:
Wang, Yong.
面頁冊數:
169 p.
附註:
Source: Dissertation Abstracts International, Volume: 64-10, Section: B, page: 5089.
Contained By:
Dissertation Abstracts International64-10B.
標題:
Engineering, Chemical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3110456
ISBN:
9780496579945
Microfluidic technology for integrated thermal management: Micromachined synthetic jet.
Wang, Yong.
Microfluidic technology for integrated thermal management: Micromachined synthetic jet.
- 169 p.
Source: Dissertation Abstracts International, Volume: 64-10, Section: B, page: 5089.
Thesis (Ph.D.)--Georgia Institute of Technology, 2003.
This work presents the use of organic multilayer lamination of epoxy-glass printed wiring board material to produce microfluidic structures, and the exploitation of these structures along with integrated drivers to develop a synthetic-jet-based integrated cooling solution for electronic systems. This process implements the synthetic jet to produce an active cooling substrate (ACS), in which the jet driver, ducting, and outlet ports for chip cooling are integrated in the thickness of the printed wiring board substrate. The electromagnetic actuator, which consists of a permanent magnet and a voice coil, is used to vibrate the laminated polymeric corrugated diaphragm. Two prototypes of ACS devices, vertical and tangential, are developed. The fluid mechanics and thermal performance of these devices are characterized. A computational fluid mechanics software package, Fluent, is employed to explore the synthetic jet fluid mechanics and heat transfer problem from the numerical solution perspective. Based on the experimental and simulation results, a sophisticated methodology is developed for future engineering analysis to design new synthetic-jet-based microjet devices with optimal geometries to fulfill different application requirements.
ISBN: 9780496579945Subjects--Topical Terms:
1018531
Engineering, Chemical.
Microfluidic technology for integrated thermal management: Micromachined synthetic jet.
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This work presents the use of organic multilayer lamination of epoxy-glass printed wiring board material to produce microfluidic structures, and the exploitation of these structures along with integrated drivers to develop a synthetic-jet-based integrated cooling solution for electronic systems. This process implements the synthetic jet to produce an active cooling substrate (ACS), in which the jet driver, ducting, and outlet ports for chip cooling are integrated in the thickness of the printed wiring board substrate. The electromagnetic actuator, which consists of a permanent magnet and a voice coil, is used to vibrate the laminated polymeric corrugated diaphragm. Two prototypes of ACS devices, vertical and tangential, are developed. The fluid mechanics and thermal performance of these devices are characterized. A computational fluid mechanics software package, Fluent, is employed to explore the synthetic jet fluid mechanics and heat transfer problem from the numerical solution perspective. Based on the experimental and simulation results, a sophisticated methodology is developed for future engineering analysis to design new synthetic-jet-based microjet devices with optimal geometries to fulfill different application requirements.
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