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Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Handbook of thin-film deposition processes and techniques/ edited by Krishna Seshan.{me_controlnum}
其他題名:	principles, methods, equipment and applications /
其他作者:	Seshan, Krishna.
出版者:	Norwich, N.Y. :Noyes Publications/William Andrew Pub., : c2002.,
面頁冊數:	1 online resource (xxviii, 629 p.) :ill.
內容註:	Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.
標題:	Thin film devices - Handbooks, manuals, etc. - Design and construction -
電子資源:	http://www.sciencedirect.com/science/book/9780815514428
ISBN:	1591241936 (electronic bk.)

Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /
Handbook of thin-film deposition processes and techniquesprinciples, methods, equipment and applications /[electronic resource] :edited by Krishna Seshan.{me_controlnum} - 2nd ed. - Norwich, N.Y. :Noyes Publications/William Andrew Pub.,c2002. - 1 online resource (xxviii, 629 p.) :ill. - Materials science and process technology series. Electronic materials and process technology. - Materials science and process technology series.Electronic materials and process technology..

Includes bibliographical references and index.

Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.

The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

ISBN: 1591241936 (electronic bk.)

Source: 153812:153972Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

1613517
Thin film devices
--Design and construction--Handbooks, manuals, etc.Index Terms--Genre/Form:

542853
Electronic books.

LC Class. No.: TK7872.T55 / H36 2002eb

Dewey Class. No.: 621.3815/2

Handbook of thin-film deposition processes and techniques = principles, methods, equipment and applications /
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520 $a The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
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