溫家慶
Overview
| Works: | 1 works in 0 publications in 0 languages | |
|---|---|---|
Titles
以無電鍍Ni-Zn-P做為微電子銲點底層金屬之介面組織特徵研究 = = Study on interfacial morphology of microelectronic solder joints with electroless Ni-Zn-P under bump metallization /
by:
溫家慶; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)