Chau, Hung.
概要
| 作品: | 1 作品在 0 項出版品 0 種語言 | |
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書目資訊
Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
by:
Chau, Hung.; ProQuest Information and Learning Co.; University of California, Irvine., Engineering - M.S..
(書目-電子資源)