Chau, Hung.
Overview
| Works: | 1 works in 0 publications in 0 languages | |
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Titles
Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
by:
Chau, Hung.; ProQuest Information and Learning Co.; University of California, Irvine., Engineering - M.S..
(Electronic resources)