Basavalingappa, Adarsh.
概要
| 作品: | 1 作品在 0 項出版品 0 種語言 | |
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書目資訊
Modeling and Studying the Effect of Texture and Elastic Anisotropy of Copper Microstructure in Nanoscale Interconnects on Reliability in Integrated Circuits.
by:
Basavalingappa, Adarsh.; State University of New York at Albany., Nanoscale Science and Engineering-Nanoscale Engineering.
(書目-電子資源)